Industry News | 2014-09-09 12:33:50.0
– Panasonic Factory Solutions Company of America introduces the NPM-D3 to the award-winning, multi-functional NPM-series SMT platform. In addition to its interchangeable, plug-and-play placement heads, the NPM-D3 integrates solder paste inspection (SPI), adhesive dispense (ADH), and post-placement inspection (AOI).
Industry News | 2016-08-23 12:33:23.0
Pickering Interfaces today announced their new Cable Design Tool. This graphics-based web tool allows users to create customized cable assemblies using very detailed design characteristics including a selection of connector types, wire type, pin definitions, pin and cable labeling, cable bundling, length selection, sleeving comments and more.
Industry News | 2019-06-30 21:12:33.0
BTU International today announced that it will have a PYRAMAX 100A at the SEMICON West Smart Manufacturing Pavilion. The event is scheduled to take place July 9-11, 2019 at the Moscone Center in San Francisco, CA. The smart manufacturing data-sharing will be enabled by Cimetrix’s Sapience product which runs on the SECS/GEM framework. BTU has supported SECS/GEM protocol for many years and is well-versed in this standard.
Industry News | 2022-05-18 12:33:57.0
ASC International is pleased to announce that the VisionPro Merlin Benchtop API System is an all new dramatically improved system. It is a constantly evolving system tailored to ASC's customer's needs.
Industry News | 2022-11-15 12:33:16.0
SHENMAO America, Inc is pleased to introduce its newest offering: PF735-EP307 Joint Enhanced Solder Paste (JEP). The new low melting point epoxy-based solder material has been developed for extremely fine-pitch or fine pad soldering, especially advanced display assembly.
Industry News | 2024-03-11 18:12:33.0
Hanwha Techwin Automation Americas is pleased to announce that its XM520 High-Speed Dual Lane Chip Mounter has been honored with the 2024 NPI Award in the Component Placement - High-Speed category. Recognized for its best-in-class speed and applicability, the XM520 sets a new standard of flexibility in surface mount technology (SMT) and through-hole technology (THT) production.
Industry News | 2024-03-18 12:33:56.0
StenTech® Inc. is excited to announce its participation in the upcoming SMTA Dallas Expo & Tech Forum, scheduled to take place on March 19, 2024, at the Plano Event Center. As a trusted partner in delivering cutting-edge solutions for leading electronic manufacturers, StenTech will be exhibiting its innovative stencil, tooling, and parts solutions that empower customer success.
Industry News | 2008-07-19 12:33:16.0
Agilent Technologies Inc. (NYSE: A) today announced the availability of scanning microwave microscopy (SMM) mode, a unique imaging technique that combines the comprehensive electrical measurement capabilities of a performance network analyzer (PNA) with the outstanding spatial resolution of an atomic force microscope (AFM).
Industry News | 2009-08-28 12:33:31.0
WATERTOWN, MA - September 2009 — Devoted to the development of new radiation detector and systems technology, RMD Instruments Corp. announces that it will premier a new solder analysis and identification feature of its innovative LeadTracer-RoHS XRF system in booth 504 at the upcoming IPC Midwest Conference & Exhibition, scheduled to take place September 23-24, 2009 at the Renaissance Schaumburg Hotel & Convention Center in Schaumburg, IL.
Industry News | 2010-05-12 13:12:33.0
Delivering a robust alternative to high-temperature solder processes, Henkel has developed Hysol ECCOBOND CA3556HF, a silver-filled electrically conductive adhesive designed to offer fast cure at low temperature. The material is ideal for high-throughput production processes and applications that dictate high peel strength, such as the assembly of photovoltaic (PV) modules, automotive sensors and membrane switches that incorporate temperature-sensitive substrates.
