Industry News | 2018-10-11 19:33:26.0
Anda Technologies USA announces that its Board Handling Conveyors are ideal for a range of PCB handling applications and can optimize Work-In-Progress (WIP) material flow during assembly, coating, dispensing and other processes.
Industry News | 2004-09-27 17:12:27.0
High-Resolution X-Ray Inspection Under $60K
Industry News | 2018-08-23 20:35:58.0
Z-AXIS, Inc., has earned design approval and begun production of a CF-rated custom medical power supply for a leading medical equipment company, one of the industry’s global top ten by revenue.
Industry News | 2004-10-01 12:15:58.0
Verifer HR High-Resolution X-Ray Inspection Solution Under $60K
Industry News | 2018-05-03 11:19:15.0
Pickering Interfaces announced that the U.S. Air Force, Ogden Air Logistics Complex at Hill AFB, Utah, recently awarded them a contract for a large quantity of their 6U High-Density Matrix modules (model 45-542) for the PXI switching requirement that is part of the PATS-70A (Portable Automated Test Set) for the O-Level and I-Level maintenance of A-10C aircraft.
Industry News | 2016-05-13 11:56:03.0
The process of manufacturing and qualifying IC's consists of many steps while Temperature forcing systems play a crucial role in the final testing process. These environmental tests assure quality and reliability by stressing the device on one hand as well as helping to characterize and validate it on the other hand (making sure manufacturing outcome meets the design requirements). At later stages the temperature testing can support failure analysis effort and root cause analysis. AS common practice we are dealing with few different kinds of temperature forcing systems: Chambers, Thermal Stream systems and Direct Thermal Head systems. In this article I would like to focus on the practical aspects of utilizing Thermal Stream systems and Direct Thermal Head systems.
Industry News | 2016-05-13 12:00:12.0
The process of manufacturing and qualifying IC's consists of many steps while Temperature forcing systems play a crucial role in the final testing process. These environmental tests assure quality and reliability by stressing the device on one hand as well as helping to characterize and validate it on the other hand (making sure manufacturing outcome meets the design requirements). At later stages the temperature testing can support failure analysis effort and root cause analysis. AS common practice we are dealing with few different kinds of temperature forcing systems: Chambers, Thermal Stream systems and Direct Thermal Head systems. In this article I would like to focus on the practical aspects of utilizing Thermal Stream systems and Direct Thermal Head systems.
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