Industry News: 125mm (Page 2 of 3)

Indium Corporation’s New Indium10.8HF Solder Paste Technology Exhibits Best-in-Class Non-Wet Open Performance

Industry News | 2016-03-23 20:19:20.0

Indium Corporation's new Indium10.8HF is a halogen-free, no-clean solder paste that is formulated to provide industry-leading non-wet open performance on large, high IO electronic packages, such as microprocessors.

Indium Corporation

New Vishay Proximity Sensor with a Vertical-cavity Surface-Emitting Laser (VCSEL) released by New Yorker Electronics

Industry News | 2021-05-11 15:00:29.0

New Vishay Proximity Sensor designed for High Performance in Consumer and Industrial Applications

New Yorker Electronics

High-speed solar-cell metallization platform cuts delivery times, leverages global support infrastructure

Industry News | 2008-03-15 15:57:29.0

Heralding a new era of responsive and flexible metallization solutions available at fast turnaround, DEK has introduced the PVP1200 screen printer capable of 1200 wafers-per-hour throughput and offering advanced automated features for high speed and repeatability. The first showing of this new printer will be at BTU�s Solar Lab Grand Opening, in Shanghai, 18-19 March 2008.

ASM Assembly Systems (DEK)

FINEPLACER® matrix – "The new generation" World premiere at Productronica in Munich

Industry News | 2009-12-07 18:52:26.0

With the FINEPLACER® matrix, Finetech is not only extending its product range, but also pointing the way forward for the product family. The modular thinking behind the FINEPLACER ®s has been further perfected. Depending on the customer's requirements, the platform can be configured either as a high-end rework system or as a high-precision assembly and bonding system. In each case there are two accuracy options available, of 10 µm and 3 µm.

Finetech

Pickering to showcase ultra-high density Reed Relays at electronica

Industry News | 2016-09-22 17:41:20.0

Pickering Electronics will be showcasing its latest high density range at electronica on 8 – 11, November 2016 in booth B1.550.

Pickering Interfaces Ltd.

Pickering present ultra-high density Reed Relays at ITC

Industry News | 2016-10-16 19:10:53.0

Pickering Electronics will be showcasing its latest high density range at the International Test Conference on booth 216, 15 – 17 November 2016.

Pickering Interfaces Ltd.

Pickering present ultra-high density Reed Relays at ITC

Industry News | 2016-11-14 19:11:37.0

Pickering Electronics, a leading provider of Reed Relays, will be showcasing its latest high density range at the International Test Conference on booth 216, 15 – 17 November 2016.

Pickering Interfaces Ltd.

New Yorker Electronics Releases Vishay Integrated RGBC-IR Sensors with I2C Interface

Industry News | 2020-12-23 19:16:42.0

The VEML3328 and VEML3328 Sensors Detect Red, Green, Blue, Clear and IR Light in a Standard and Side-Looking Package

New Yorker Electronics

Palomar Introduces New Automatic

Industry News | 2003-05-05 09:13:55.0

Reliable Wire Bonders for High Yield Production

Palomar Technologies

Pickering To Showcase Ultra-High Density Reed Relays at Electronica

Industry News | 2016-09-22 21:57:52.0

Pickering Electronics will be showcasing its latest high density range at electronica on 8 – 11, November 2016 in booth B1.550.

Pickering Electronics


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