Industry News | 2021-11-02 08:42:03.0
New Global Study from IPC Finds 9 in 10 Manufacturers Report Rising Costs, Vast Majority See Lack of Qualified Talent in North America and Globally
Industry News | 2013-01-31 17:40:20.0
IPC announced today the December findings from its monthly North American Printed Circuit Board (PCB) Statistical Program.
Industry News | 2015-10-11 16:19:40.0
Photo Stencil announces that Susan Holmes, VP engineering and customer service for Photo Stencil, will present the paper Stencil Design for Wafer Level Ball Drop and Flip Chip Assembly at the IWLPC during Session 10 on Wednesday, October 14, 2015, at 5:00 PM. The 12th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition is being held at the Doubletree San Jose Airport Hotel, San Jose, CA.
Industry News | 2013-05-13 14:06:16.0
Leading analysts IDTechEx find that the total market for printed, flexible and organic electronics will rocket from $16 Billion in 2013 to $77 Billion in 2023. The majority of that is OLEDs (organic and soon to be printed) and conductive ink used for a wide range of applications of printed electronics. This market will experience 14.5% CAGR over the next 5 years.
Industry News | 2021-12-14 15:19:37.0
High-Efficiency Power Inductors from New Yorker Electronics are Magnetically Shielded for Low Core Loss
Industry News | 2009-06-05 07:47:18.0
Paul Nickelsberg, spoke at MDG Forum: Why medical devices fail and what you need to do to prevent it from happening
Industry News | 2011-07-28 18:27:19.0
Advanced Thermal Solutions, Inc, (ATS), continues its innovations in electronics thermal management with the BWT-104 Bench Top Wind Tunnel. The BWT-104 is a research quality, open loop wind tunnel for thermally characterizing components, circuit boards and cooling devices such as heat sinks, heat exchangers and cold plates.
Industry News | 2003-05-16 08:57:38.0
Agilent 5DX Series 5000 also named 2003 Product of the Year by Frost & Sullivan's surface mount technology and electronic components group
Industry News | 2023-11-20 15:30:34.0
In many miniaturized electronics applications, conventional cable wiring is both costly and material-intensive. It also limits the scope for innovation and product performance. The HyPerStripes (Hybrid integrated high performance electronic stripes) project addresses these limitations by developing technologies and production processes for long, smart and flexible electronic systems that can replace conventional cables. HyPerStripes focuses on two key applications: On the one hand, on medical instruments used in minimally invasive procedures (e.g., catheters and implants); and on the other hand, on environmentally friendly LED lighting surfaces.
Valor Computerized Systems
