Industry News | 2010-02-17 18:45:59.0
The SMTA International Technical Committee invites you to submit an abstract for the 2010 conference. Short course descriptions are also being solicited.
Industry News | 2010-05-07 16:01:14.0
New this year! The SMTA International Technical Committee invites you to participate in a poster session at SMTA International. Poster sessions are presented on the show floor and are a great way to present current research and results in a concise manner without requiring a technical paper.
Industry News | 2013-01-02 16:01:34.0
A Convenienient and informative online tutorial about Design and Assembly Process Challenges for Bottom Terminations Components
Industry News | 2015-11-25 16:58:05.0
On behalf of the SMTA International Technical Committee, we invite you to submit a 300 word abstract of your research for the 2016 SMTA International 2016 technical conference in Rosemont, Illinois. Papers should describe significant results from experiments, emphasize new techniques, and contain technical, economic or appropriate test data. We are looking for papers on a variety of topics related to electronics manufacturing including advanced packaging/components, assembly, business/supply chain, emerging technologies, harsh environment applications, PCB technology, and process control. Materials must be original, unpublished and non-commercial in nature.
Industry News | 2010-11-30 13:30:04.0
Ironwood Electronics' new package converter - PC-BGA256B/BGA256E-B-01 allow previous product version to be used in the new system boards for test/validation until the new BGA device is released from the foundry or vice versa. These package converters can be soldered directly onto the SMT pads of development boards using standard solder methods.
Industry News | 2008-04-07 21:16:55.0
FINETECH announces that it will display the FINEPLACER� CRS7.MD system at the upcoming NEPCON China 2008 trade show and exhibition, scheduled to take place April 8 to 11, 2008, in Shanghai, China.
Industry News | 2011-02-14 16:05:28.0
Design engineers using 0.8mm pitch 96 position BGA ICs will be interested in the PA-BGA96C-Z-01 probing and prototyping adapter with GHz BGA socket from Ironwood Electronics. Ironwood Electronics recently introduced a new BGA socket addressing high performance requirements for testing clock driver IC's. The socket is constructed with high performance and low inductance elastomer contactor.
Industry News | 2008-10-07 12:56:56.0
APS Novastar introduces automatic Vision Control for its L-Series pick and place systems. Vision Control advances the already precise, fast and reliable placement of 0201's with 100% accurate on-the-fly, bottom-up vision placement of micro BGA's and ultra fine pitch QFP's.
Industry News | 2022-03-07 16:53:18.0
Odyssey 1325 provides high reliability BGA alloy exchange and component re-finishing capabilities.
Industry News | 2011-02-26 14:35:16.0
Ironwood Electronics has recently introduced a new high performance WLCSP socket for 0.5mm pitch 40 ball WLCSP and 0.4mm pitch 30 ball WLCSP accommodated in the same socket.
