Industry News | 2003-02-10 10:18:43.0
For Century Conformal Coating System
Industry News | 2011-03-11 14:53:57.0
A new study conducted by IPC — Association Connecting Electronics Industries® predicts that reporting requirements for conflict minerals proposed by the U.S. Security and Exchange Commission (SEC) would cost the electronic interconnect industry an estimated $279 million in the first year of implementation for due diligence alone, compared to the government’s estimate of $16.5 million.
Industry News | 2011-03-09 21:41:57.0
Economically, 2010 was a better year than expected in most parts of the world. Although Japan experienced exceptionally high growth in 2010, this was the year that China overtook Japan to become the second-largest world economy after the USA.
Industry News | 2011-06-29 16:18:11.0
IPC recently submitted comments to the U.S. Securities and Exchange Commission (SEC) regarding the legal basis for a phase-in of the conflict minerals regulatory requirements.
Industry News | 2012-04-03 13:02:23.0
BANNOCKBURN, Ill., USA, April 3, 2012 — IPC — Association Connecting Electronics Industries® announced the Japanese language release of the E revision of IPC-A-610, 電子組立品の許容基準. IPC’s most widely-used standard.
Industry News | 2013-01-30 17:54:43.0
Design, assembly, inspection and repair personnel have a new tool to help improve reliability of ball grid arrays (BGAs) and fine-pitch ball grid arrays (FBGAs) in high density applications, thanks to the newly released C revision of IPC-7095, Design and Assembly Process Implementation for BGAs.
Industry News | 2024-03-26 13:20:18.0
IPC releases EMS industry results for February 2024
Industry News | 2003-02-20 08:17:45.0
Signaling Key Victory for U.S. PCB Industry, Says IPC
Industry News | 2010-04-10 02:16:34.0
IPC has released the E revision of IPC-A-610, Acceptability of Electronic Assemblies. IPC's most widely-used standard, which provides visual acceptance criteria for post assembly mechanical and soldering assembly requirements, now addresses additional technologies, including flexible circuits, board in board, package on package, depanelization and additional SMT terminations.
Industry News | 2012-04-27 19:20:10.0
PCB Technology Trends 2011, a new study published this week by IPC — Association Connecting Electronics Industries®, shows how the demands of miniaturization and high-speed technology are driving changes in printed circuit board (PCB) processes and materials.
