Industry News | 2010-11-30 13:30:04.0
Ironwood Electronics' new package converter - PC-BGA256B/BGA256E-B-01 allow previous product version to be used in the new system boards for test/validation until the new BGA device is released from the foundry or vice versa. These package converters can be soldered directly onto the SMT pads of development boards using standard solder methods.
Industry News | 2002-07-25 15:33:58.0
Glenbrook Technologies has announced the availability of a newly developed large capacity, ultra-high resolution X-ray inspection system, "Oversized" Jewel box 90-C. The system facilitates x-ray inspection of larger assembled printed circuit boards (PCBs) up to 18" x 24".
Industry News | 2012-04-11 15:15:57.0
Invensas Will Demo xFD Solutions at IDF Beijing and Present at the International Conference on Electronics Packaging in Tokyo
Industry News | 2022-09-26 07:17:35.0
Gen3, Global leader in SIR, CAF, Solderability, Ionic Contamination & process optimisation equipment, received a 2022 Mexico Technology Award in the category of Test Equipment for its AutoCAF2+ and CLRHV Bridge. The award was announced during a ceremony that took place Wednesday, Sept. 21, 2022 during SMTA Guadalajara in Mexico.
Industry News | 2002-04-30 09:42:25.0
The MTC5522 Was Designed Using Multilink's Micro-Module(TM) Technology
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