Industry News | 2023-10-18 17:43:18.0
HELLER's High UPH Vacuum Reflow Oven clinched the coveted "Step-by-Step Excellence Awards" - Innovation Award owing to its industry-leading product strength and outstanding performance.
Industry News | 2003-02-24 09:40:18.0
Will continue the share repurchase program from February 25, 2003 to January 5, 2004.
Industry News | 2003-03-13 08:19:18.0
The Flakafix 2.54mm grid IDC board-to-cable connector can now be supplied with a variety of terminations including surface mount, solder-in, press-fit and pin-in-paste.
Industry News | 2014-04-27 12:59:18.0
MIRTEC, “The Global Leader in Inspection Technology,” announces that it has been awarded a 2014 EM Asia Innovation Award in the category of Test & Measurement / Inspection Systems – AOI for its MV-7 OMNI.
Industry News | 2003-04-11 08:53:18.0
This agreement establishes PCS as the exclusive representative of RSI in the UK and the Republic of Ireland.
Industry News | 2020-10-03 08:42:18.0
MIRTEC received a 2020 GLOBAL Technology Award in the category of Inspection – AOI Systems for its MV-6Z OMNI 3D In-Line AOI system. This represents the 12th Global Technology Award presented to MIRTEC for its Technologically Advanced Inspection Solutions. The award was announced during a Virtual Awards Ceremony on Tuesday, Sept. 29, 2020.
Industry News | 2010-03-24 12:21:18.0
MIRTEC, "The Global Leader in Inspection Technology", announced that it will premier its complete line of AOI and SPI systems at APEX 2010.
Industry News | 2014-04-22 14:31:18.0
MIRTEC announces that it will highlight its award-winning 2D/3D In-Line AOI Series configured with MIRTEC’s exclusive OMNI-VISION® 3D Inspection Technology in its distributor pb tec solutions’ booth, # 7-504, at the SMT/Hybrid/Packaging 2014 exhibition, scheduled to take place May 6-8, 2014 in Nuremberg, Germany.
Industry News | 2015-06-11 16:02:18.0
MIRTEC, "The Global Leader in Inspection Technology," will exhibit its most recent solutions for System in Package (SiP) inspection and measurement at SEMICON WEST 2015; July 14-16, 2015, at the Moscone Center in San Francisco, CA. Visitors are invited to booth # 2343 for a detailed demonstration of this exciting new technology.
Industry News | 2003-04-15 08:57:18.0
First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies
