Industry News | 2021-02-12 16:52:12.0
Virtual Industries Inc. offers the STEALTH-VAC™ ELITE ESD-SAFE Kit – Normally Closed VACUUM PEN™ (Order #VVSV-NC-KIT). The system operates on compressed air or nitrogen.
Industry News | 2013-09-12 07:21:30.0
Techcon Systems has designed a new High Output Series dispensing nozzle in an effort to continuously provide high-quality and high-performance products to meet new market and application demands.
Industry News | 2018-07-17 19:28:35.0
Virtual Industries features a product line of hand tools that replace tweezers or other gripping means for many applications. The PEN-VAC Kit with 8 Probes + Cups and Vacuum Pen Holder is a completely self-contained unit. There are not any batteries or hoses to get in the way.
Industry News | 2009-02-09 16:00:37.0
COLORADO SPRINGS, CO � February 9, 2009 � Virtual Industries, Inc., a leading supplier of manual vacuum handling solutions, introduces the self-contained manually operated PEN-VAC PRO-SERIES Vacuum-Tweezer for handling SMD packages, optics or other small parts during assembly. The tweezer has no vacuum hoses to get in the way and no batteries to replace.
Industry News | 2020-11-13 17:08:31.0
Virtual Industries Inc. is pleased to announce that it is seeing increased interest in the market for its Black Plastic PRO-SERIES PEN-VAC™ Kit (V8910-BK-KIT-ESD). These vacuum pens are ideal for SMT assembly or for handling any parts that have a non-porous surface.
Industry News | 2023-08-03 08:20:35.0
ViTrox, which aims to be the world's most trusted technology company, is excited to announce its first-ever participation in ELEXCON Shenzhen 2023, one of the influential trade shows in Southern China, at Hall 9, Booth #9G17 in Shenzhen Convention & Exhibition Center (SZCEC), China from 23rd to 25th August 2023.
Industry News | 2022-02-21 16:26:19.0
Six new Versions of the VSMA designed with 42mil Chip for 1.5A DC operation with Support for Pulsed Currents up to 5.0A
Industry News | 2003-09-25 13:32:47.0
Reduce waste and cost.
Industry News | 2004-04-27 15:19:57.0
Zymet has introduced a new reworkable underfill encapsulant, CN-1453, designed for BGA encapsulation. Removal of defective BGA's is easily accomplished by heating the component and the underfill encapsulant to 220°C. Underfill encapsulant residues are easily scraped or brushed off.
Industry News | 2018-10-18 10:43:28.0
Suggested 14 and 16 Layer Board Layouts
