Industry News | 2019-08-08 22:35:07.0
The SMTA is pleased to announce three inspiring keynote presentations scheduled during SMTA International 2019. Adam Steltzner, Ph.D., NASA, will keynote SMTA International the morning of Tuesday, September 24 with his presentation “The Right Kind of Crazy: A True Story of Teamwork, Leadership and High Stakes Innovation.” Adam will share the challenges he faced leading the landing team for NASA’s Curiosity Rover on its mission to Mars. The lessons learned from those struggles illustrate how to better lead high performing teams, manage innovation and drive towards excellence.
Industry News | 2011-02-09 14:58:43.0
Keeping on top of ever-changing environmental regulations around the world and understanding how those regulations impact electronics manufacturers and their suppliers are the first steps on the long and winding road to compliance. Providing a roadmap to compliance, the IPC It’s Not Easy Being Green Symposium, May 11–12, 2011, in Boston, Mass., will give companies up-to-date information on the laws and regulations that affect every link of the electronics manufacturing supply chain, from Europe and Asia to South America and the United States.
Industry News | 2011-05-03 22:50:52.0
Assemblers who have tried to resolve problems that stem from the rapidly growing array of advanced packages are getting some help from IPC with the newly released IPC-7093, Design and Assembly Process Implementation for Bottom Termination Components. This standard describes the critical design, assembly, inspection, repair, and reliability issues associated with bottom termination components (BTCs) whose external connections consist of metallized terminals that are an integral part of the component body.
Industry News | 2012-01-22 23:16:58.0
More than 350 engineers who attended last week’s IPC webinar, Soldering and Assembly Defects, were polled on their biggest headaches with printed boards, PCB components and PCB assembly process failures. The survey results which identify solder finish, ball grid array (BGA) components and reflow soldering as the greatest challenges, provide webinar co-sponsor, National Physical Laboratory (NPL) of the United Kingdom with useful information as it prepares its NPL Process Defect Clinic for IPC APEX EXPO® 2012.
Industry News | 2012-06-07 09:26:31.0
Highlights Federal Regulations that Burden Electronics Manufacturers
Industry News | 2003-06-11 08:00:48.0
IPC has begun a comprehensive study of the three leading lead-free alloys (Tin-Silver-Copper) in an effort to analyze the properties of the leading candidates for lead-free assembly.
Industry News | 2012-11-13 09:35:09.0
Comprehensive updates on pressing industry concerns, challenges and developments will be addressed in 50 IPC APEX EXPO® professional development courses, February 17–18 and February 21, 2013, at the San Diego Convention Center.
Industry News | 2009-02-21 17:56:00.0
BANNOCKBURN, Ill. and ARLINGTON, Va., USA, February 19, 2009 � IPC � Meeting the requirements of RoHS (restriction of the use of certain hazardous substances in electrical and electronic equipment) compliance and successfully implementing lead-free electronics assembly processes is an ongoing challenge for the electronic interconnect industry. To help companies work toward their compliance goals, IPC and JEDEC present �Transitioning to Lead Free � Strategies for Implementation,� a three-day conference to be held March 3�5, 2009 in Santa Clara, Calif.
Industry News | 2016-05-20 06:19:59.0
JBC launches a new dip soldering system to make your work easier.
Industry News | 2006-05-04 17:10:10.0
Documents to help manufacturers reduce the risk of tin whiskers in Pb-free products
