Industry News: 1a33 high temp cure (Page 1 of 2)

Nordson EFD Introduces Unity HiTemp Disposable Syringe Barrels that Withstand up to 180° C for Eight Hours

Industry News | 2015-12-02 17:52:02.0

Nordson EFD introduces Unity™ HiTemp™ syringe barrels. These disposable 30cc barrels reduce the downtime and maintenance costs often associated with aluminum barrels commonly used in the pneumatic dispensing of hot melt adhesives.

Nordson EFD

PROMATION introduces Super Cooling Conveyor

Industry News | 2005-12-19 16:34:56.0

SCC-700 Quickly cools high temp applications with minimal floor space.

PROMATION, Inc.

High-Accuracy R&D Die Bonder on Display at Finetech Booth #505 at IMAPS 2012 – San Diego

Industry News | 2012-09-05 08:13:47.0

Finetech will showcase the FINEPLACER® Lambda in Booth #505 at the upcoming IMAPS 45th International Symposium on Microelectronics exhibition

Finetech

FINETECH to Showcase Sub-Micron Bonder at IMAPS 2010

Industry News | 2010-10-04 16:32:22.0

FINETECH will showcase the FINEPLACER® Lambda in booth 706 at the upcoming IMAPS 2010 Exhibition, scheduled for November 2-4, 2010 at the Raleigh Convention Center - Research Triangle in Raleigh, NC.

Finetech

FINETECH to Showcase Sub-Micron Bonder at SPIE Photonics West 2011

Industry News | 2011-01-05 15:36:14.0

FINETECH will showcase the FINEPLACER® Lambda in Booth 2204 at the upcoming SPIE Photonics West exhibition, scheduled for January 22-27, 2011 at the Moscone Center in San Francisco.

Finetech

FINETECH to Showcase Modular Die Bonder at IMAPS 2011 – Long Beach

Industry News | 2011-09-12 13:16:36.0

FINETECH will showcase the FINEPLACER® Lambda in Booth #306 at the upcoming IMAPS 44th International Symposium on Microelectronics exhibition

Finetech

FINETECH to Showcase Sub-Micron Bonder at SEMICON West 2010

Industry News | 2010-06-23 12:33:29.0

FINETECH will showcase the FINEPLACER® Lambda in booth 5570 at the upcoming SEMICON West exhibition, scheduled to take place July 13-15, 2010 at the Moscone Center in San Francisco.

Finetech

FINETECH to Showcase Sub-Micron Bonder at IMAPS Device Packaging 2011

Industry News | 2011-02-14 16:47:35.0

FINETECH will showcase the FINEPLACER® Lambda in Booth #58 at the upcoming IMAPS Device Packaging conference and exhibition, scheduled to take place March 8-9, 2011 at the Radisson Fort McDowell Resort in Scottsdale, AZ.

Finetech

Bonding Platform FINEPLACER� Micro MA � Accuracy Meets Flexibility

Industry News | 2007-11-27 12:13:09.0

FINEPLACER� Micro MA is a bonding platform characterized by an enlarged working space (max. substrate size 460 mm x 310 mm) combined with placement accuracy better than 10 micron. The system is suitable for small component assembly with a pitch down to 50 micron.

Finetech

FINETECH to Showcase Chip-to-Wafer Packaging with Sub-Micron Bonder at Photonics West 2009

Industry News | 2009-01-16 17:14:22.0

FINETECH will showcase chip-to-wafer bonding with the sub-micron placement accuracy FINEPLACER� Femto at the upcoming Photonics West exhibition (booth 519) in San Jose, CA, January 27-29, 2009

Finetech

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