Industry News | 2010-10-30 02:09:14.0
The premiere of Electronics Midwest, a joint production of IPC – Association Connecting Electronics Industries® and UBM Canon, was a confirmed win-win-win success for exhibitors, attendees and organizations alike.
Industry News | 2019-08-08 08:16:10.0
KIC today announced plans to exhibit in Booth 1C01 at NEPCON Asia, scheduled to take place Aug 28-30, 2019 at the Shenzhen Convention and Exhibition Center. Company representatives will showcase the new SRA (Smart Reflow Analyzer) and RPI i4.0
Industry News | 2014-10-13 18:17:46.0
ADLINK Technology announced the opening of demo room developed in collaboration with Intel at ADLINK's Shanghai Operations Center as the kick-off event for a newly-signed collaborative technology strategy. Combining Intel's latest development technologies with ADLINK's established design capabilities, this new era of cooperation promises to deliver advanced, cutting-edge switching, transcoding, and deep packet inspection solutions for the next iteration of the intelligent edge cloud computing platform.
Industry News | 2013-11-12 16:12:53.0
Juki Automation Systems announces that it was awarded a 2013 Global Technology Award in the category of “Placement – Medium to High Volume” for its RX-6 Flex Placer. T
Industry News | 2017-02-15 13:18:55.0
Juki Automation Systems today announced that the companies were awarded a joint 2017 NPI Award. The award was presented to the companies in the Component Storage category for the new ISM UltraFlex 3600 during a Tuesday, Feb. 14, 2017 ceremony that took place at the San Diego Convention Center during the IPC APEX EXPO.
Industry News | 2019-04-16 19:50:51.0
Nepcon China, booth no. 1J20 At the upcoming Nepcon China show, Viscom will showcase their powerful range of full 3D AOI, 3D AXI and 3D SPI inspection systems highlighting cutting-edge smart factory integration and a new 3D AOI with unprecedented speed and versatility.
Industry News | 2019-01-05 16:30:40.0
Feeder Finger will exhibit at the 2019 IPC APEX EXPO, scheduled to take place Jan. 29-31, 2019 at the San Diego Convention Center. The company today announced plans to launch its new cut tape solution for Panasonic CM and NPM Feeders in Booth #2926.
Industry News | 2016-10-04 19:16:23.0
Engineered Material Systems is pleased to debut its 640-35 (dam) and 640-46 (fill) dam and fill UV cured chip encapsulants for chip-on-board smart card applications.
Industry News | 2019-03-25 19:51:31.0
KIC today announced plans to exhibit in Booth 1G10 at NEPCON China, scheduled to take place April 24-26, 2019 at the Shanghai World Expo Exhibition & Convention Center. Company representatives will showcase the new SRA (Smart Reflow Analyzer) and RPI i4.0
Industry News | 2020-01-07 11:40:01.0
New PSV2800, 4x programming performance increase for Universal Flash Storage on LumenX & Machine learning based automated teach with NexTeach ProTM for the PSV7000
