Industry News | 2022-06-24 10:13:15.0
SHENMAO America, Inc. is pleased to offer its enhanced Solder Joint Encapsulation Material (SJEM) SMEF-Z52 Flux. The SJEM Flux combines the abilities of conventional flux and underfill. The epoxy cures after reflow and provides excellent bonding strength and joint protection. Joint reliability performance is elevated as well.
Industry News | 2022-07-19 13:31:23.0
New OSM-compatible SiP Integrates ST Microelectronics' STM32MP1 MPU with Arm CortexA7/M4 for Industrial and IoT Applications
Industry News | 2022-08-14 14:26:09.0
SHENMAO America, Inc. offers PF606-P269J Lead-Free Jetting Solder Paste specially designed for the jetting process. It offers excellent workability and solderability for automatic high-speed jetting production with superior accuracy and precision.
Industry News | 2022-10-11 17:22:18.0
SHENMAO America, Inc. has successfully developed a no-clean high thermal impact reliability solder paste. PF918-PW216 solder paste adopts the newly designed high reliability lead-free alloy (Sn/4Ag/3Bi) that achieves tensile strength performance 1.4 times higher than typical SAC305 alloys.
Industry News | 2023-02-27 18:10:50.0
SHENMAO America, Inc. has released its PF735-PQ10-10L Low Melting Point Lead-Free Solder Paste. The paste has been designed specifically for the SMT process and is applicable to the high-speed printing process to increase production capacity.
Industry News | 2023-05-22 18:45:34.0
SHENMAO America, Inc. is proud to announce the release of its new SMBF-08 Visible No-Clean BGA Flux. This innovative flux is specifically designed to meet the demands of surface mount technology (SMT) assembly and BGA ball mount processes, offering enhanced visibility and performance.
Industry News | 2024-04-29 08:41:00.0
SHENMAO Technology proudly presents its latest innovation, the PF719-P250A solder paste, specifically designed for AI substrate power management modules. This cutting-edge solder paste represents a significant advancement in thermal fatigue reliability and performance.
Industry News | 2018-10-29 11:22:27.0
ADLINK Technology today released two new CompactPCI® 2.0 processor blades, the cPCI-3630 and cPCI-6636. 3U cPCI-3630 and 6U cPCI-6636 further enhance ADLINK’s extensive, rugged CompactPCI processor blade portfolio and provide technology upgrade solutions for railway transportation, military, aviation and industrial automation.
Industry News | 2010-12-17 21:18:00.0
Die Router Solutions GmbH veröffentlicht die Version 2.0 der populären ViPRA – Visualization in Paperless Repair and Assembly™ Software.
Industry News | 2015-02-13 10:28:50.0
ADLINK Technology today announced to showcase amongst other products the following innovative highlights for Embedded World 2015 in Nuremberg:
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