Industry News | 2011-11-20 12:31:32.0
MIRTEC, "The Global Leader in Inspection Technology", has been awarded a Global Technology Award in the category of Inspection Equipment - AOI for its MV-7 2D/3D In-Line AOI Series.
Industry News | 2003-02-24 09:32:24.0
Now available with an easy-to-use dispensing gun, Electrolube TCR is a single-component, highly thermally conductive RTV sealant.
Industry News | 2003-05-23 08:24:49.0
Solid cables of up to 35mm2 cross-section now can be connected to PCBs easily, reliably and cost-effectively with the new Power Combicon range of connectors.
Industry News | 2003-06-17 08:07:40.0
The Radiall SMT coupler range now includes the new 14.2 x 5.1mm mini type.
Industry News | 2023-11-13 12:28:17.0
MIRTEC announces the development of groundbreaking inspection technologies that it will unveil at productronica 2023, scheduled to take place Nov. 14-17 at the Messe München in Munich, Germany. The new systems address critical challenges in 3D inspection performance of solder joints, inspection speed for tall component inspections, and measurement range limitations, offering manufacturers the perfect solution for enhanced quality and productivity.
Industry News | 2003-02-20 08:04:10.0
The Mini-Fix card-to-cable connector is designed to withstand hundreds of mating cycles with high contact security and mechanical stability.
Industry News | 2003-03-04 08:08:23.0
In a move that broadens its interconnect design services, Micromark C and CD has introduced a new development kit for the Flexstrip jumpers flexible interconnect system.
Industry News | 2015-10-22 16:28:47.0
MIRTEC, “The Global Leader in Inspection Technology,” will premier the technologically advanced MV-6 OMNI 3D Series in Hall A2, Stand 139 at the upcoming Productronica international trade fair, scheduled to take place November 10-13, at the Messe in Munich, Germany.
Industry News | 2017-10-17 19:32:15.0
MIRTEC, “The Global Leader in Inspection Technology,” is pleased to announce plans to exhibit its award-winning MV-6 OMNI 3D AOI System in Hall A2, Booth 329 at productronica 2017, scheduled to take place Nov. 14 – 17, 2017 at the Messe München in Germany. Additionally, the company will show the MS-11e 3D SPI, MV-3 OMNI Desktop 3D AOI and INTELLISYS® software.
Industry News | 2019-08-12 20:03:57.0
MIRTEC, ‘The Global Leader in Inspection Technology,’ today announced that it will display its award-winning 3D AOI, 2D AOI and SPI Inspection Systems in booth #1C55 with Mir Tech-win at the upcoming NEPCON ASIA (NEPCON SOUTH CHINA) exhibition, scheduled to take place August 28-30, 2019 at the Shenzhen Convention & Exhibition Center in China.
