Industry News: 2.50std technical process (Page 1 of 294)

Frost & Sullivan Award Highlights Heller Industries' Achievements in Global SMT Reflow Soldering Equipment Market

Industry News | 2013-05-21 22:12:09.0

Based on its recent analysis of the surface mount technology (SMT) reflow soldering equipment market, Frost & Sullivan recognizes Heller Industries, Inc. with the 2013 Global Frost & Sullivan Award for Market Share Leadership.

Heller Industries Inc.

HELLER Convenes a Successful 2024 Sales Kickoff Meeting, Setting the Stage for a Strong Year Ahead

Industry News | 2024-02-26 16:22:08.0

HELLER, a leading provider of reflow soldering equipment, concluded its 2024 Sales Kickoff Meeting in Suwon, South Korea on a high note. The meeting brought together sales representatives from all branches and subsidiaries to discuss the company's unified goals and objectives for the year ahead, and to equip them with the tools and knowledge necessary to achieve success.

Heller Industries Inc.

GPD Global Appoints the Leading Representative Firm in the Southeast

Industry News | 2013-03-12 11:34:11.0

GPD Global has appointed Technical Resources Corporation (TRC) as its representative in Florida, Puerto Rico and the Caribbean.

GPD Global

Whizz Systems, Inc. Awarded for Elite Contract Services

Industry News | 2020-10-03 09:34:59.0

Whizz Systems, Inc. received a 2020 GLOBAL Technology Award in the category of Contract Services $25-50 million. The award was announced during a Virtual Awards Ceremony on Tuesday, Sept. 29, 2020.

Whizz Systems

Whizz Systems, Inc. Celebrates 20th Year of Providing Electronics Product Design & Manufacturing

Industry News | 2019-03-21 14:10:17.0

Whizz Systems is pleased to announce the company’s 20th year in business. Located in the heart of Silicon Valley, Whizz Systems was founded in 1999 by a team of elite engineers who specialized in high-mix, low-volume EMS services.

Whizz Systems

New Service has PCB Cleaning Down to a Fine Art

Industry News | 2003-06-26 09:02:38.0

The surface quality of printed circuit boards and components directly impacts performance and product life.

SMTnet

MIRTEC Announces Technical Collaboration with Universal Instruments’ Advanced Process Lab

Industry News | 2019-10-21 16:37:01.0

MIRTEC is pleased to announce that it has installed one of its Award-Winning MV-6 OMNI 3D AOI Systems at Universal Instruments’ Advanced Process Lab (APL) in Conklin, New York. Universal’s APL offers comprehensive research, analytical and advanced assembly services that enable manufacturers to realize rapid product introduction, maximize yield and optimize reliability.

MIRTEC Corp

Legacy Electronics Receives U.S. Patent for 3-D Memory Module with Canopy-type Carriers

Industry News | 2003-05-30 08:26:20.0

The inventors of this module type and holders of the patent are chief technical officer Kenneth J. Kledzik and president Jason C. Engle, both of San Clemente, California.

SMTnet

Shipley Company Announces Distribution Agreement with Unichem Industries

Industry News | 2003-04-18 08:31:57.0

Unichem to enhance its support and service for North American dry film photoresist and soldermask lamination equipment customers.

SMTnet

Cookson Assembly Materials Announces Price Increase

Industry News | 2003-02-24 09:54:40.0

Effective March 3, Cookson Electronics Assembly Materials (Jersey City, NJ) will increase prices for its products by an average of 3 percent, the company announced today.

SMTnet

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