Industry News | 2008-12-15 16:20:40.0
Minneapolis, MN � The SMTA Technical Committee invites industry professionals to submit abstracts for the International Conference on Soldering and Reliability to be held May 20-22, 2009 in Toronto, Ontario, Canada. Following on the very successful events of the past two years, this conference will once again bring together the community of soldering and reliability experts.
Industry News | 2009-08-21 23:20:40.0
Minneapolis, MN – The SMTA and MEPTEC are proud to announce the keynote speakers for their co-organized 2009 Medical Electronics Symposium
Industry News | 2018-10-18 08:44:36.0
Lead-free Reflow Profile: Soaking type vs. Slumping type
Industry News | 2018-10-18 08:27:03.0
An Analysis of SMT Solder Paste Printing Defects
Industry News | 2004-09-09 15:20:40.0
V.J. Electronix, Inc. introduces the VJE X2500, the first fully automated
Industry News | 2018-09-06 20:40:50.0
Kurtz Ersa today announced plans to exhibit at the SMTA New England Expo & Tech Forum, scheduled to take place Wednesday, Sept. 12, 2018 at the DCU Center in Worcester, MA. The company will highlight the award-winning HR 550 Ersa Hybrid Rework System.
Industry News | 2018-12-18 20:40:14.0
SHENMAO America, Inc. is pleased to announce the appointment of BERNA Electronics and REPCON Electronics as its distribution partners in Mexico. With more than 25 years of proven experience in the EMS industry, the companies have a presence in the main industrial and electronics manufacturing regions of Mexico.
Industry News | 2017-07-09 20:40:11.0
SHENMAO Technology, Inc. introduces New Generation Ultra Tacky Flux SMF-WC52 applied in the Flip Chip dipping process. Its high tacky property keeps Chip in place during reflow for excellent soldering performance, while creating outstanding solder joint strength.
Industry News | 2017-07-10 21:20:40.0
KIC announces the appointment of Larry Fey as Principal Electrical Engineer. Fey is an exceptionally skilled and accomplished electrical engineer with more than 27 years of hands-on design experience. He has been active in all phases of product development, including feasibility studies, planning, design, CAD, assembly, testing, field trials, production support and customer assistance.
Industry News | 2010-04-30 20:40:07.0
Following numerous customer requests for smaller wave solder machines with many of the key features of larger ones, Manncorp has introduced System 16.350. It is a derivative of the 28.400, one of the best-selling high-volume wave solder machines the company has ever offered, according to CEO Henry Mann.
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