Industry News | 2006-10-13 14:15:55.0
Dynatech Technology and Samsung Techwin today announced that Dynatech is adding sales and service for Samsung Techwin's line of printing, reflow and board handling equipment to complement the Samsung Techwin line of SMT placement systems in North America. The announcement was made by Isaac Robinson, Dynatech Technology, and S.S. Kim, Samsung Techwin.
Industry News | 2007-09-25 21:42:42.0
Agilent Technologies Inc. (NYSE: A) today announced that the U.S. Navy has selected the company's test equipment for the General Purpose Electronic Test Equipment program.
Industry News | 2010-04-22 19:28:54.0
RANCHO CUCAMONGA, CA - Aqueous Technologies Corp. announces that it has been awarded two 2010 EMAsia Innovation Awards in the categories of Cleaning Equipment and Environmentally Friendly Products/Materials for its Trident QUAD. The award was presented to the company during an April 21, 2010 ceremony that took place at the Shanghai Everbright Convention & Exhibition Center during NEPCON China 2010.
Industry News | 2006-05-12 15:57:12.0
Diagnosys promoted Andy Quick to Applications Engineer and hired Mike Quick as Field Support Engineer. Andy Quick will be based in Chicago, and Mike Quick will be based in Kissimmee. Both will serve customers throughout the United States.
Industry News | 2006-12-06 07:58:37.0
Valor joins MYDATA third-party partnership program
Industry News | 2006-10-17 11:50:48.0
ENDICOTT, NY
Industry News | 2006-12-05 13:30:13.0
ENDICOTT, NY
Industry News | 2008-06-26 13:55:19.0
BEAVERTON, OR � June 24, 2008 �A-Laser, a division of FCT Assembly and a premier laser cutting service specializing in the ablation of ultra-thin metals and plastics, recently increased its capacity through the purchase of its next LPKF Microline 600 laser system. The equipment is used to process ultra-thin materials used in a wide range of industries and was chosen because of the achievable cut quality and positional accuracy.
Industry News | 2009-04-23 20:18:43.0
Fine Line Stencil has been awarded a 2009 EMAsia Innovation Award in the category of Assembly Line Systems/Equipment for its UltraSlic FG solder paste stencil.
Industry News | 2011-06-07 16:08:52.0
Seika Machinery announces the promotion of Isao Muraoka to President and CEO.
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