Industry News | 2017-06-14 10:46:29.0
GPD Global offers uniquely designed 2-part mixing pump to accurately mix and dispense two-part components while eliminating entrapped air.
Industry News | 2023-08-14 12:12:00.0
SHENMAO America, Inc. is pleased to announce the availability of its PF735-LT201 Low-Temperature Lead-Free No-Clean Solder Wire. This advanced solder wire is designed to meet the evolving needs of the electronics industry, offering exceptional solderability and reliability for low-temperature PCBA soldering and rework processes.
Industry News | 2016-03-23 07:54:42.0
Benoit Pouliquen has been appointed as Corporate Senior Vice President and Global Head of the Electronics business of Henkel Adhesive Technologies. He is succeeding Alan Syzdek who retired last year.
Industry News | 2016-09-21 15:44:21.0
From booth #936 at the upcoming SMTA International event in Rosemont, Illinois, Henkel Adhesive Electronics’ display will underscore why the company leads the market in comprehensive assembly materials technologies. With multi-award-winning LOCTITE GC solder materials, a broad range of leading-edge thermal management technologies, and new applications for TECHNOMELT products, the Henkel booth is the go-to destination for advanced electronics assembly materials.
Industry News | 2020-06-24 15:22:46.0
The Assembly Solutions division of MacDermid Alpha Electronics Solutions will be introducing its ultra-low temperature solder and 5G solutions at the Productronica China show from July 3-5, 2020, at the National Exhibition and Convention Center in Shanghai.
Industry News | 2016-05-09 21:47:59.0
Henkel Adhesive Technologies’ Electronics business today announced a new distribution partnership with plastic film and adhesives solutions provider, Tekra, A Division of EIS, Inc. Under the terms of the agreement, Tekra will deliver sales, technical consultation and post-sale service for Henkel’s full line of electronic ink materials in support of customers throughout North America.
Industry News | 2016-03-27 14:19:07.0
Henkel Adhesive Technologies’ award-winning Technomelt® materials have long been recognized as the industry standard for high-performance low pressure molding applications. Extending the effectiveness of the portfolio outside of proven encapsulation processes, a newly-formulated Technomelt is now also providing a streamlined and economical alternative to conventional masking techniques for various coating requirements.
Industry News | 2017-03-01 13:13:55.0
Henkel Adhesive Technologies today announced that Steven Abramovich has been named Head of Sales, Americas for its electronics business. Previously Vice President of Channel Management for the company, Abramovich lends 30 years of results-driven sales and marketing experience to his new role.
Industry News | 2019-08-19 22:58:44.0
Seika will showcase a complete line up of leading-edge equipment in Booth #410 at SMTA International. Products includes the latest models from McDry, Sayaka, SAWA, Unitech and MALCOM.
Industry News | 2016-03-30 09:04:09.0
Adding functional capability to its award-winning Technomelt® hot melt encapsulants, Henkel Adhesive Technologies today announced another formulation milestone with the development of a thermally conductive Technomelt material. With the ability to transfer heat through the encapsulating layer, thermally conductive Technomelt products offer dual-function performance in a single material solution.
