Industry News | 2015-01-15 19:44:09.0
SMTA and Chip Scale Review magazine announced the best papers from the 2014 International Wafer-Level Packaging Conference (IWLPC.) Winners were selected from each of the three tracks covering Wafer Level Packaging, 3-D (Stacked) Packaging, and MEMS Packaging, as well as an overall Best Paper and Best of Conference winner. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging.
Industry News | 2018-08-29 19:56:28.0
Nordson ASYMTEK announces that it has received ISO 9001:2015 Quality Management System certification from DNV GL. The certificate scope covers The Design and Manufacture of Automated Fluid Dispensing and Coating Systems.
Industry News | 2015-11-16 09:05:29.0
The CoaxCenter 6000 received the productronica Innovation Award 2015. It is the first machine system that processes micro-coaxial cables fully-automatically and with high precision.
Industry News | 2015-02-16 17:56:57.0
ASYS is proud to announce that several new innovations and products will be shown at the upcoming IPC APEX in San Diego. Uptime is an important factor in any SMT production, as it is a key measurement to judge how efficient a plant is operating. Therefore, ASYS continued the development of PULSE. An entire production line can be monitored not only via a tablet, but now even via a smartwatch called PULSE Wear. Important to note that this is an open interface, so any equipment supplier is welcome to take advantage of it.
Industry News | 2015-02-20 10:50:52.0
Mycronic will showcase smarter electronic inventory control and innovative big board applications at IPC APEX 2015. Pointing to explosive demand for “smart cars”, smartphones, tablets and LED lighting, Mycronic says it will introduce next-generation electronic assembly solutions to help subcontractors and OEMs navigate this fast-moving climate with high productivity. New solutions to be on display include stencil-free jet printing at speeds up to 1,080,000 dots per hour, more flexible pick-and-place solutions, software and next-generation inventory management with innovate Agilis Smart Bin technology.
Industry News | 2015-10-05 18:40:58.0
The Condor, MTS 505 is the latest generation of flying probe test system from Digitaltest. The system now provides support for larger and heavier boards. When combined with our latest measurement hardware it can provide even higher test coverage while keeping maintenance requirements extremely low. With new sophisticated software, new hardware innovations, comprehensive boundary scan integrations (JTAG Technologies/Göpel Electronic) and new flying and opens check probes, the new Condor MTS 505 is equipped for the future of fixtureless testing.
Industry News | 2015-12-01 12:48:55.0
The team of technology leader ASM Assembly Systems can look back on an extraordinarily successful Productronica 2015. In the impressive booth, which was largest yet covering 650 square meters, visitors had to fight for space to view “live” the progress the company has made on the path to the Smart #1 SMT Factory. Equally popular were the workshops and product presentations ASM Assembly System’s offered during the technology inhouse show at its Munich headquarters. Highlights at both locations included the SIPLACE BulkFeeder for tape-free component feeding, the new DEK NeoHorizon printers in interaction with the ASM ProcessExpert as the first self-learning inline expert system for SMT production, and integrated SIPLACE solutions for material logistics. The new ultra-compact SIPLACE TX high-volume placement modules received Global SMT & Packaging’s innovation award in the “High-Volume Placement” category. Also popular was a study which ASM developers presented in cooperation with robotics manufacturer KUKA. It demonstrated how intelligent, self-propelled robots can help line operators refill components or pick up component reels from the automatic SIPLACE Material Tower storage system.
Industry News | 2015-08-20 12:02:27.0
Graco will highlight its new InvisiPac® GM100 Plug-Free™ Hot Melt Applicator and LineSite™ Remote Monitoring Solution at Pack Expo 2015. The GM100 offers all the benefits of plug-free adhesive dispensing in a compact design, while LineSite reduces adhesive costs and boosts production in packaging industry applications through remote system monitoring.
Industry News | 2015-03-17 16:18:19.0
Ryder Industries today announced that it will exhibit at the Hong Kong Electronics Fair (Spring Edition) in booth #5C - C02 in Hall 5, scheduled to take place April 13-16, 2015 at the Hong Kong Convention and Exhibition Centre, hosted by the Hong Kong Trade Development Council.
Industry News | 2015-04-09 11:23:43.0
Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), will exhibit its market-leading portfolio of Test and Inspection equipment in Booth No. 7A-131 at SMT/Hybrid/Packaging, scheduled to take place May 5-7, 2015 at the Messe in Nuremberg, Germany.
