Industry News | 2016-07-02 06:40:16.0
SHENMAO BGA Solder Spheres for PBGA, CBGA, TBGA, CSP and Flip Chip Assemblies are made by UMT (Ultra Micron Technology) from highly pure metals produced to various exact Alloy compositions using Piezoelectric Droplet Jet Technology in high volumes to accurate diameter uniformity, bright shiny surface finishes and high quality sphericity. Various diameters (0.75, 0.6, 0.5, 0.45, 0.3, 0.25, 0.1, 0.08, 0.07, 0.06 and 0.05 mm Dia.) are available at affordable low cost from 8 worldwide SHENMAO locations.
Industry News | 2016-08-23 16:30:00.0
SHENMAO BGA Solder Spheres for PBGA, CBGA, TBGA, MBGA, CSP and Flip Chip Assemblies are made by UMT (Ultra Micron Technology) from highly pure metals produced to various exact Alloy compositions using Piezoelectric Droplet Jet Technology in high volumes to accurate diameter uniformity, bright shiny surface finishes and high quality sphericity. Various diameters (0.76, 0.6, 0.5, 0.45, 0.3, 0.25, 0.1, 0.08, 0.07, 0.06 and 0.05 mm Dia.) are available at affordable low cost from 11 worldwide SHENMAO Technology locations.
Industry News | 2016-05-21 07:36:35.0
SHENMAO Bumping Solder Paste PF608-PI-21 (Sn/Ag4.0/Cu0.5/x) and PF606-P-BS1 (Sn/Ag3.0/Cu0.5/x) aim to decrease voids in wafer bumping process. SHENMAO MICRO MATERIAL INSTITUTE applications engineers focused on developing the Bumping Solder Paste Formula with excellent stencil printing transfer rate and the lowest Void to optimize manufacturing process performance. The world’s largest IC Packaging and Test Service OSAT utilize SHENMAO Bumping Solder Paste in production.
Industry News | 2016-01-05 15:27:41.0
Digitaltest will be demonstrating their New Flying Probe and Reverse Engineering Software at the IPC Apex show in Las Vegas, NV, Booth 1547, March 15th to 17th, 2016.
Industry News | 2016-05-20 06:19:59.0
JBC launches a new dip soldering system to make your work easier.
Industry News | 2016-12-21 11:14:01.0
Driven by emerging technology and to suit customer special requirements XYZTEC Condor Sigma's comprehensive range of bond tests is always increasing. One of our latest applications made scratch testing of complex coating much easier to achieve and increased throughput by several orders of magnitude.
Industry News | 2016-02-11 13:49:50.0
Mycronic AB has acquired 75 percent of RoyoTech Digitalelektronik GmbH and has an option to acquire the remaining 25 percent. At the same time Mycronic acquires 100 percent of Kognitec Vertrieb and Service GmbH. Both companies are based in Höhenkirchen, Germany.
Industry News | 2018-05-02 20:33:35.0
Digicom Electronics announces that the white paper, Digicom Electronics and CASPER'S Technology Open Endless Possibilities for Astronomy and Aerospace Innovation and Collaboration, is now available on the www.Digicom.org website.
Industry News | 2017-07-19 21:31:43.0
Digicom Electronics announces it has been certified by Intertek for AS9100:2016 (RevD) and ISO 9001:2015. AS9100:2016 (RevD) is the standard for organizations that design and manufacture products for the aerospace industry, including parts, components and assemblies. Prepared by the International Aerospace Quality Group (IAQG), with representatives from aviation, space, and defense companies in the Americas, Asia/Pacific and Europe, AS9100:2016 (RevD) standardizes quality management system requirements.
Industry News | 2016-06-19 20:07:24.0
Saki Corporation will present its 3D automated optical inspection (AOI) equipment with innovative side-angle cameras and ring lighting technology at NEPCON Thailand 2016, held June 22-25, 2016, at BITEC in Bangkok, Thailand. Saki's 2D AOI system for simultaneous double-sided PCB inspection will also be on display.
