Industry News | 2003-05-05 09:21:23.0
Features a 50% Reduction in Length
Industry News | 2012-11-06 15:34:50.0
Multitest, announces that its MT9510 x16 has proven its outstanding temperature accuracy of ±2.0°C at an Asian high-volume production site.
Industry News | 2022-09-16 17:11:00.0
VPG Foil Resistors Line of 2-Terminal Power Resistors Provide Low Resistance Values and Improved TCR under High Stress Conditions
Industry News | 2008-04-07 21:09:26.0
FINETECH announces that it will display the FINEPLACER� Lambda system at the upcoming NEPCON China 2008 trade show and exhibition, scheduled to take place April 8 to 11, 2008, in Shanghai, China. This high precision bonder provides a placement accuracy of � 0.5 micron.
Industry News | 2010-03-17 18:31:55.0
EAST HANOVER, NJ – Zymet has introduced a new silica-filled reworkable board-level underfill encapsulant, X2825, whose coefficient of thermal expansion, CTE, is 26 ppm/°C. The underfill enhances drop and shock test reliability and, compared to higher CTE underfills, provides superior thermal cycle performance.
Industry News | 2012-07-19 13:24:57.0
Multitest, announces that its MT9928 gravity handler ideally supports the special features of the recently launched ecoAmp Kelvin contactor.
Industry News | 2021-02-04 10:54:09.0
The USB4 can Simultaneously Transfer both Audio and Video over the Same Connection at speeds up to 40Gbps
Industry News | 2002-07-16 18:58:23.0
GiveMePower and At Work Computers Partner
Industry News | 2014-01-27 23:30:28.0
ADLINK Technology announced its new Matrix MXE-5400 fanless embedded computer with industry-leading performance, based on 4th Gen Intel® Core™ i7-4700EQ quad-core processor. The MXE-5400 delivers outstanding performance, excellent manageability, optimized connectivity, and rugged design in a compact package.
Industry News | 2015-06-16 23:31:55.0
ADLINK Technology today announced the release of their ADLINK EtherCAT solution, consisting of the Talos-3012 IEC 61131-3-compliant automation controller and EPS Series time-deterministic I/O and motion control system. The combined solution provides time-deterministic control of automatic process, featuring high performance, easy development, rugged construction, intelligent management in ultra-small form factors, and minimal total cost of ownership.
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