Industry News: 20in and 2006 (Page 9 of 10)

Speed Up Your AOI and X-ray Inspection with Viscom at APEX

Industry News | 2016-02-15 17:53:06.0

Viscom will exhibit in Booth #1763 at the 2016 IPC APEX EXPO. Viscom's applications experts will present the company's new 3D AOI and X-ray developments.

Viscom AG

Speed Up Your AOI and X-ray Inspection with Viscom at APEX

Industry News | 2016-02-17 17:43:57.0

Viscom announced today that it will exhibit in Booth #1763 at the 2016 IPC APEX EXPO, scheduled to take place March 15-17, 2016 at the Las Vegas Convention Center. Viscom’s applications experts will present the company’s new 3D AOI and X-ray developments.

Viscom AG

The New X8011-II PCB—Offline X-ray with Unbeatable Brilliance, Complete 3D and Intelligent Linking

Industry News | 2016-03-18 12:02:25.0

The MXI system X8011 PCB, constructed by Viscom in Germany and sold worldwide for many years, has undergone a thorough revision. Viscom is introducing the result, the X8011-II PCB, alongside other systems at the SMT in Nuremberg.

Viscom AG

Viscom at productronica with outstanding solutions for 3D AOI and 3D AXI

Industry News | 2017-10-12 15:10:33.0

From Nov. 14-17, 2017, at the world's foremost trade fair, productronica 2017, Viscom AG will present its cutting-edge solutions for optical inspection systems with 3D technology under the motto "Solutions for me." Close cooperation with customers and Viscom's decades of expertise have resulted in products that convince with very fast handling, excellent inspection results and the simplest operation. The new developments are focused on the challenges arising from increasing product changes and higher production volumes, miniaturization and Industry 4.0.

Viscom AG

Interview with Ms Michelle Lim, General Manager of Reed Exhibitions � Singapore and Malaysia

Industry News | 2008-09-09 18:15:32.0

Michelle Lim of Reed Exchibition discussing the upcoming GlobalTRONICS exhibition

Reed Exhibitions

FCT Solder and The Balver Zinn Group Win a 2008 EMAsia Innovation Award for SN100C Solder Alloy

Industry News | 2008-04-09 14:34:22.0

GREELEY, CO � April 2008 � FCT Solder, a division of FCT Assembly, announces that it has been awarded a 2008 EMAsia Innovation Award in the category of Soldering Materials for the SN100C Paste. The award was presented to the company during an April 9, 2008 ceremony that took place at The Foyer outside the Grand Ballroom of the Shanghai Everbright International Hotel during Nepcon China 2008.

FCT ASSEMBLY, INC.

Viscom’s S3088 SPI Will Be Part of the NPL Solder Paste and Solder Joint Automatic Inspection Experience at SMTAI

Industry News | 2015-09-23 16:47:32.0

Viscom announced today that its S3088 SPI system will be featured in the SMTA International – National Physical Laboratory (NPL) Defect Database Live Solder Paste and Solder Joint Automatic Inspection Experience from Sept. 29-30, 2015 on the show floor. This year's special feature area will include live printing ultra-fine pitch deposits, 0201 and 01005 devices, inspection and measurement of different combinations of materials, plus some of the key in-process inspection steps to make a process perform correctly.

Viscom AG

CyberOptics Recognized with Two EM Asia Innovation Awards MRS-Enabled Inspection and Measurement Systems have now garnered 12 awards

Industry News | 2019-04-25 18:56:51.0

CyberOptics announced that it was awarded two 2019 EM Asia Innovation Awards in the categories of Test & Measurement/Inspection Systems – SPI for its SQ3000™ Multi-Function for AOI, SPI and CMM and Software Systems for its SQ3000™ CMM. The awards were presented to the company during an April 25, 2019 ceremony at the Shanghai World Expo Exhibition & Convention Center during NEPCON China.

CyberOptics Corporation

High-Capacity Circuit Simulator, Combined with Additional Data Display, Electromagnetic Analysis and System-Level Design Tools Help Speed High-Frequency RFICs to Market

Industry News | 2007-12-13 20:21:46.0

Agilent Technologies Inc. (NYSE: A) today announced the availability of GoldenGate Plus for RFIC simulation, analysis and verification. Agilent's GoldenGate Plus product line speeds the design of large-scale RFICs for wireless communication products.

Agilent Technologies, Inc.

Viscom presents powerful 3D AOI and SPI with ultra-modern data exchange for Industry 4.0 at SMTA Guadalajara

Industry News | 2017-10-12 15:01:31.0

Viscom is pleased to announce plans to exhibit the 3D AOI system S3088 ultra gold and 3088 basic at SMTA Guadalajara Expo & Tech Forum, scheduled to take place Oct. 18-19, 2017 at Hotel Riu Guadalajara. Viscom will showcase its latest high-performance 3D AOI and SPI systems – S3088 series – along with a number of exciting new 3D imaging features and the new Viscom Open Interface 4.0.

Viscom AG


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