Industry News | 2024-01-29 10:48:07.0
SMTXTRA USA is pleased to announce the appointment of Performance Technologies Group (PTG) as its representative for the region spanning from Virginia to Maine. This strategic collaboration enhances SMTXTRA's presence and accessibility in the SMT industry, particularly in aerospace, automotive, energy, medical, and general sectors.
Industry News | 2009-05-06 14:53:51.0
With the SIPLACE SX, Munich-based technology leader Siemens Electronics Assembly Systems (SEAS) introduces a placement machine that opens the door to totally new manufacturing concepts and delivers significantly more efficiency in response to increasingly frequent product changeovers and massive demand fluctuations.
Industry News | 2017-04-25 21:31:19.0
Hanwha Techwin Automation Americas, formerly Samsung C&T Automation, commits to providing quality sales, service, and support of precision assembly line solutions configured for LED big board applications including PCB form factors of 1.2 and 1.5 meters in length.
Industry News | 2024-04-22 10:35:20.0
SMTXTRA is pleased to announce the appointment of MaRC Technologies as its representative for the Pacific Northwest region of the United States.
Industry News | 2024-05-13 09:57:48.0
SMTXTRA is proud to announce the appointment of E-Tronix, a Stromberg Company, as its Manufacturers' Representative for key territories across the United States.
Industry News | 2008-05-18 01:14:27.0
Essemtec AG, a leading manufacturer of surface mount technology production equipment, now closes the last gap in the placement stage of surface mount devices. The new option, FLX-CVU, verifies the electrical characteristics of components directly in the placement machine, ensuring unsurpassed placement reliability and product quality.
Industry News | 2015-10-11 15:35:54.0
New placement modules, tapeless feeders, new screen printers and the first expert system that optimizes SMT processes automatically. At Productronica 2015 (November 10-13, Munich Trade Fair Center), technology leader ASM Assembly Systems will present a show unlike any other under the motto “On the move to the Smart #1 SMT Factory”. On 650 square meters at booth A3.377, the SMT experts will lay out their roadmap to the Smart Factory with a “Speed Quality” line and a “Flexible Quality” line featuring totally innovative technologies. The focus will be best-in-class equipment, automation tools, production process networking and integration, and transparent material logistics. At the “Speed Quality” line, new SIPLACE TX placement modules will ring in the mass placement of super-small 0201 (metric) components. A single SIPLACE TX module alone can place up to 78,000 of these per hour at full speed at smallest footprint. With its compact design, it also sets new records in speed, floorspace performance and placement accuracy. Components in sizes from 0402 through 01005 will be supplied loosely and without tapes thanks to the new SIPLACE BulkFeeder. This ASM innovation finally bans reels and splicing from the SMT production floor. With the DEK NeoHorizon and DEK NeoHorizon Back-to-Back, the ASM team will also unveil new, powerful screen printers. Most of the visitors’ attention, however, will be focused on the ASM ProcessExpert. This first inline expert system in the industry establishes a new product category in electronics manufacturing. By running virtual prints based on Gerber data, the ASM ProcessExpert subjects the stencil to a DFM (design for manufacturability) health check. By stabilizing and optimizing the printing process automatically, this highly innovative system represents a milestone on the path to self-optimizing SMT lines. Each of these innovations constitutes a building block for the Smart Factory.
Industry News | 2013-09-14 09:00:12.0
Essemtec will exhibit in booth #827 at the upcoming SMTA International Exhibition, scheduled to take place October 15-16, 2013 at the Fort Worth Convention Center in Texas.
Industry News | 2014-04-16 09:02:14.0
Europlacer announces that it will showcase the new Lzero3, along with the iineo-II and Speedprint SP710avi, in Booth #B-1C25 at NEPCON China, which is scheduled to take place April 23-25, 2014 at the Shanghai World Expo & Exhibition Convention Center (Hall 1) in Shanghai, China.
Industry News | 2012-03-30 13:42:24.0
New technologies such as package on package (PoP) component assembly or bare die assembly on COB applications, as well as the optimization of material consumption demands for increased knowledge of the actual placement forces.