Industry News: 20ppm (Page 1 of 1)

Teradyne Introduces Optima 7210 Optical Process Test 'OPT' System

Industry News | 2003-04-02 09:03:49.0

Configural Recognition(TM) Object and Image-Analysis Technology Enables One-Hour Program Generation

SMTnet

New Yorker Electronics Reveals Promising Option for Hard-To-Find Oscillator Devices

Industry News | 2022-06-08 15:03:39.0

Raltrons' XCO Series Oscillators Deliver in 4 Weeks When Other Manufacturers Have 50 - 60 Weeks Lead Times

New Yorker Electronics

Engineered Material Systems Introduces New Dam and Fill Chip Encapsulants for Circuit Assembly Applications

Industry News | 2012-02-22 01:32:21.0

Engineered Material Systems introduces its DE-7826 (dam) and CE-7826 (fill) Dam and Fill Chip Encapsulants for chip-on-board (COB) applications.

Engineered Materials Systems, Inc.

Press Release: YINCAE’S New High Purity Liquid Encapsulant: SMT 158HA

Industry News | 2018-02-14 10:15:17.0

Press Release YINCAE’S New High Purity Liquid Encapsulant: SMT 158HA

YINCAE Advanced Materials, LLC.

Industry's First Dual Frequency Ceramic Package Programmable Oscillator Developed by Fox

Industry News | 2001-08-29 12:25:31.0

Fox Electronics has announced the availability of the frequency control industry's first dual frequency ceramic package programmable oscillator. This newest JITO-2, the latest in Fox's expanding line of Just-In-Time Oscillators, provides any standard or custom frequency from 340kHz to 250MHz, plus any other frequency representing the selected frequency divided by 2, 4 or 8.

FOX Electronics

CupraEtch™ DT25 - Atotech’s New Photoresist Adhesion Process

Industry News | 2014-01-16 09:31:26.0

The increased challenge of miniaturization with increased functionality within the PCB industry leads to the constant need for new technologies for high volume manufacturing. As line and space features decrease, requirements on the photoresist as well as its pre-treatment steps increase.

Atotech

AI Technology (AIT) Introduces Novel High Temperature Large Area Underfill with Proven Stress Absorption

Industry News | 2014-07-28 13:56:52.0

240°C and novel stress absorbing capabilities to allow long-term reliability of large area flip-chip devices.

AI Technology, Inc. (AIT)

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