Industry News | 2012-07-17 20:55:30.0
First Step in IPC’s Printed Electronics Initiative to Help Industry Grow
Industry News | 2012-07-19 16:40:42.0
On July 25, IPC will launch its new educational campaign, Follow the Law, Protect the Board, to raise awareness and compliance with federal regulations on the export of printed boards (PCBs) designed for International Traffic in Arms Regulations (ITAR) controlled equipment
Industry News | 2012-08-02 19:31:50.0
On August 22, IPC and the Chicagoland Circuit Board Association (CCBA) will host a meeting at IPC Midwest Conference & Exhibition on IPC’s new educational campaign, Follow the Law, Protect the Board.
Industry News | 2012-10-31 15:53:31.0
B revision of IPC/WHMA-A-620, Requirements and Acceptance for Cable and Wire Harness Assemblies. This important industry standard is a joint effort of IPC — Association Connecting Electronics Industries® and the Wire Harness Manufacturer’s Association (WHMA).
Industry News | 2014-07-09 17:14:50.0
IPC — Association Connecting Electronics Industries®. Presenting data collected by IPC over the past two years, the report highlights North American electronics industry trends in on-shoring and domestic sourcing and includes new data on the business impact from companies that have actually engaged in some form of on-shoring.
Industry News | 2013-12-04 11:05:46.0
productronica 2013 participant statements.
Industry News | 2012-12-28 10:43:01.0
Design-2-Part Shows, America’s largest design and contract manufacturing tradeshows, are pleased to announce their 2013 show schedule.
Industry News | 2013-01-24 14:23:23.0
By attending trade fairs, MAZeT used 2012 to boost its profile as a provider of electronic development and production for embedded systems, opto-ASICs and spectral sensors for LED light in the selected target markets. The number and localization of the events attended highlight this.
Industry News | 2014-01-31 11:18:29.0
Datest reports 15 percent growth in sales for 2013 with respect to 2012.
Industry News | 2013-03-12 13:42:20.0
With new SIPLACE placement machines and many software innovations, ASM Assembly Systems underscores how important the SMT Hybrid Packaging trade show in Nuremberg has become. At Booth 7-204, the SIPLACE team will present innovations from both ends of its platform spectrum: With the SIPLACE X3 S, it unveils the latest generation of the successful SIPLACE X high-end platform, while the SIPLACE D1i is a new solution for the more price-sensitive SMT production segment.
