Industry News: 255 (Page 1 of 4)

DDI Corp. Provides Update on Negotiations with it's Senior Lenders and Convertible Noteholders

Industry News | 2003-04-04 08:46:37.0

Company Announces Further Reductions to Goodwill and Reclassifications of Indebtedness Recorded in Fiscal 2002

SMTnet

DDi Corp. Reports First Quarter Results

Industry News | 2003-05-16 08:49:08.0

PCB Sales Improved

SMTnet

IPC Releases Book-To-Bill Ratios For September 2001

Industry News | 2001-10-26 17:06:02.0

IPC today announced the U.S. Printed Wiring Board Industry Book-to-Bill Ratio for September 2001 was 0.89. Sales billed (shipments) in September 2001 decreased 41.6% over September 2000 and orders booked decreased 56.1% over September 2000.

Association Connecting Electronics Industries (IPC)

North American PCB Order Growth Bolsters Book-to-Bill Ratio

Industry News | 2014-12-29 22:00:59.0

IPC announced today the November findings from its monthly North American Printed Circuit Board (PCB) Statistical Program. Strong year-on-year order growth kept the PCB book-to-bill ratio high, while sales remained slightly below last year.

Association Connecting Electronics Industries (IPC)

SMTA Capital Chapter Presents “Electronic Manufacturing Fundamentals” Tutorial Program on June 2nd at Zentech Manufacturing

Industry News | 2016-04-13 16:56:22.0

The SMTA Capital Chapter is pleased to announce it will welcome Martin K. Anselm, Ph.D., Rochester Institute of Technology, on June 2nd to instruct a tutorial on SMT Principles at Zentech Manufacturing an ITAR facility located at 6980 Tudsbury Road, Baltimore, MD, 21244. The tutorial is scheduled from 8:30 am to 4:00 pm and includes lunch and a tour. As Zentech is an ITAR facility only US Citizens can participate in the tour. This tutorial is designed for those involved in printed board design, bare board fabrication, SMT assembly, quality control, materials purchasing, and reliability testing. New this year! Get a $20 EARLY BIRD discount on regular member and non-member registrations if registration is completed by midnight on April 30, 2016. Registration is required for this learning event.

Surface Mount Technology Association (SMTA)

SHENMAO Introduces SMF-WB02 / SMF-WB51 Water Soluble Flux

Industry News | 2015-10-22 16:43:19.0

SHENMAO SMF-WB02 / SMF-WB51 Water Soluble Flux are made locally in the USA and with the same quality in 7 other worldwide locations. It is said their Low Viscosity (easy to apply), High Tackiness (slump resistant), consistent printability for BGA and Micro BGA Ball Assemblies and excellent wash ability after high temperature reflow (255ºC and 60 sec over 220ºC) create highly reliable Solder Joints with optimum maximized Quality.

Shenmao Technology Inc.

SHENMAO Exhibits at ECTC in Las Vegas June 1-2, 2016 Booth 505 Introduces SMF-WB02 / SMF-WB51 Water Soluble Flux

Industry News | 2016-05-24 20:29:22.0

SHENMAO SMF-WB02 / SMF-WB51 Water Soluble Flux are made locally in the USA and with the same quality in 7 other worldwide locations. It is said their Low Viscosity (easy to apply), High Tackiness (slump resistant), consistent printability for BGA and Micro BGA Ball Assemblies and excellent wash ability after high temperature reflow (255ºC and 60 sec over 220ºC) create highly reliable Solder Joints with optimum maximized Quality.

Shenmao Technology Inc.

SHENMAO Introduces SMF-WB02 / SMF-WB51 Water Soluble Flux At Semicon West 2016 Booth # 6467 in San Francisco

Industry News | 2016-07-11 20:50:22.0

SHENMAO SMF-WB02 / SMF-WB51 Water Soluble Flux are made locally in the USA and with the same quality in 9 other worldwide locations. It is said their Low Viscosity (easy to apply), High Tackiness (slump resistant), consistent printability for BGA and Micro BGA Ball Assemblies and excellent wash ability after high temperature reflow (255ºC and 60 sec over 220ºC) create highly reliable Solder Joints with optimum maximized Quality.

Shenmao Technology Inc.

Techcon Systems Introduces Bench Top Fluid Dispensing Product Guide

Industry News | 2009-01-05 16:04:57.0

Garden Grove, CA � January 2009 � Techcon Systems, a product group of OK International and a leading provider of fluid dispensing systems and products, introduces its new Bench Top Fluid Dispensing Product Guide, which includes dispensers, 700 Series consumables, and dispensing tip options.

OK International

Hesse Mechatronics to Demonstrate Wedge Wire Bonding Capabilities at Productronica

Industry News | 2013-10-31 11:53:09.0

Hesse GmbH will demonstrate a full range of wedge wire bonding capabilities at Productronica, taking place November 12-15 in Munich, Germany, in Hall B2, Booth 255.

Hesse Mechatronics

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