Industry News: 256mb (Page 1 of 2)

Kingston Announces Immediate Availability of PC800-40 Rimm Modules

Industry News | 2002-05-08 10:12:19.0

With 40 Nanosecond (ns) Core Access Time

Kingston Technology

Parvus Announces Availability of Four Rugged Celeron-based Embedded Computers: SpacePC 1450, 1451, 1453, and 1850

Industry News | 2005-04-20 13:21:59.0

New PC/104-Plus SpacePC CPUs combine fanless -40C to +85C extended temperature operation with 256MB of soldered RAM for high reliability in mobile computing applications

Parvus Corporation

Parvus to Release Low Cost, Low Power, 400MHz PCI-104 Celeron CPU Module for Embedded Computer Systems

Industry News | 2004-10-27 11:26:07.0

SpacePC 8500 Offers ULV Celeron Processor with Fast Ethernet, 4 USB, 2 Serial, Audio, Parallel, Floppy and LCD/VGA Controllers

Parvus Corporation

Saelig Introduces Mercury™ T2C USB 2.0 & Power Delivery Protocol Analyzer With Type-C Connection

Industry News | 2017-06-21 11:27:14.0

USB Type-C and Power Delivery Protocol Analyzer is available in several configurations to suit specific needs and budget

Saelig Co. Inc.

SAMSUNG Develops Low-Power 8Mb SRAM/64Mb NAND Flash Stacked MCP Memory Device

Industry News | 2001-08-10 07:53:10.0

SAMSUNG has shipped the first engineering samples of a MCP device integrating 64Mb NAND-type flash memory and 8Mb SRAM. * Cost#ffective optimal solution for 3G mobile phones. * Mass production set for the second quarter of 2001.

Samsung Electronics

Samsung Electronics Aims To Be No.2 Chipmaker

Industry News | 2001-10-29 09:13:06.0

South Korea's Samsung Electronics Co Ltd, the world's fourth largest chipmaker, aims to rank second by the end of 2005 and raise its share of the global memory chip market to 30 percent. Samsung, already the largest memory chip maker, is selling 40 percent of its chips for below production cost, reflecting a record downturn in the global chip market.

Hanwha Techwin CO., LTD.

Parvus� to Release its SpacePC� 4500 Single Board Computer, a Fanless, PC/104-Plus 400MHz Celeron� CPU with Full Intel� Architecture

Industry News | 2004-06-23 10:54:01.0

Ruggedized embedded computer board to offer extended temperature operation, shock/vibration resistance, and low power consumption for demanding embedded systems apps

Parvus Corporation

Parvus Unveils Three Fanless 800MHz Pentium III PC/104-Plus CPU Modules Designed for -40C to +85C Extended Temperature

Industry News | 2005-07-11 12:52:53.0

Parvus now offers low-power Intel Pentium III-based architecture in three new ruggedized PC/104-Plus CPU boards, the SpacePC 1460, 1461 and 1463

Parvus Corporation

Coreco Imaging introduces PC-Linescan

Industry News | 2001-08-01 16:17:49.0

Frame Grabber Provides Special Features for Line Scan Applications

Coreco Imaging

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