Industry News: 265 rising table (Page 1 of 2)

North American PCB Order Growth Fuels Rise in Book-to-Bill Ratio

Industry News | 2017-08-01 20:03:49.0

IPC announced today the June 2017 findings from its monthly North American Printed Circuit Board (PCB) Statistical Program. Strong PCB order growth moved the book-to-bill ratio up to 1.08 in June, while sales remained sluggish.

Association Connecting Electronics Industries (IPC)

U.S. Electronics Manufacturers Grappling with Higher Costs from U.S. and Chinese Tariffs; U.S. Jobs and Investments at Risk

Industry News | 2019-10-23 15:26:19.0

Almost 90 percent of U.S. electronics manufacturers are troubled by the higher tariffs imposed by the United States and China on each other’s imports, and some are investing less in the United States and hiring fewer workers as a result.

Association Connecting Electronics Industries (IPC)

PCB Assembly Cost

Industry News | 2018-10-18 09:51:21.0

PCB Assembly Cost

Flason Electronic Co.,limited

New SIPLACE SX4 sets records in performance per square meter

Industry News | 2010-08-17 13:40:20.0

The SIPLACE Team has unveiled its latest placement machine, the SIPLACE SX4. As a high-speed addition to the SIPLACE SX platform, the four-gantry machine sets new standards in terms of placement performance per square meter of floor space – an important metric in the investment decision-making process. With its placement speed of up to 120,000 cph on a footprint of only 1.90 x 2.65 meters, the new machine even surpasses the previous record-holder SIPLACE X4i in terms of performance per square meter.

ASM Assembly Systems GmbH & Co. KG

New and Improved GRAB EEZ Cleanroom Wipe Dispenser

Industry News | 2021-04-20 11:26:35.0

High-Tech Conversions has released a new and improved GRAB-EEZ ESD Safe Cleanroom Wipe Dispenser.

High-Tech Conversions

Tresky to Display T-6000 Die Bonder at SEMICON West 2013

Industry News | 2013-06-20 19:12:14.0

Tresky, announces that it will display the T-6000 Flexible Automatic Die Bonder in Booth #5770 at the 2013 SEMICON West exhibition & conference, scheduled to take place July 9-11, 2013 at the Moscone Center in San Francisco, CA. Tresky will co-exhibit with XYZTEC.

Tresky AG

Tresky’s Product Technologies Provide High-Quality Solutions for Microelectronics

Industry News | 2013-06-20 19:31:51.0

Tresky, announces that its wide range of die bonder products from simple and inexpensive to fully automatic are designed to provide simple, precise and reliable solutions for many applications within the microelectronics industry.

Tresky AG

Packaging Materials Market to grow at 3% CAGR over 2018-2024

Industry News | 2018-05-21 06:11:19.0

North America is a mature packaging materials market and was valued above 500 billion in 2016. An increasingly urban lifestyle in the U.S. coupled with changes in the eating patterns of consumers will drive demand for packing materials in the country.

Global BizTeK Co.,

electronica 2010 - Where the electronics industry will demonstrate its plans to meet future business and environmental challenges

Industry News | 2010-02-25 23:32:40.0

Munich, Germany, February 15, 2010 --- Energy efficiency, environmental compatibility, cost reduction and flexibility are just some of the challenges facing the electronics industry today. At electronica 2010, the global electronics industry will demonstrate how it will rise to these challenges in the following months and years.

Messe München GmbH

Basics of Encoder and Orthogonal Coding

Industry News | 2021-12-19 20:18:34.0

Encoder is a kind of electromechanical equipment, which can be used to measure the movement of machinery or the target position of machinery. Most encoders use optical sensors to provide electrical signals in the form of pulse sequences, which can be converted into motion, direction or position information in turn.

OKmarts Industrial Parts Mall

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