Industry News: 2818 (Page 1 of 1)

IPC PERM COUNCIL WHITE PAPER EXAMINES LEAD-FREE RESEARCH PRIORITIES

Industry News | 2014-05-05 16:03:12.0

IPC’s Pb-Free Electronics Risk Management (PERM) Council has released a white paper, “PERM Council Pb-free Research Priorities” that identifies priority research areas regarding the impact and risks associated with the implementation of lead-free materials in electronics.

Association Connecting Electronics Industries (IPC)

IPC Delivers New Standard on Handling, Packaging and Storage of Printed Boards

Industry News | 2010-09-13 15:36:15.0

IPC — Association Connecting Electronics Industries® has released IPC-1601, Printed Board Handling and Storage Guidelines. The industry's sole standard on the handling, packaging and storage of printed boards, IPC-1601 provides users with guidance on how to protect printed boards from contamination, physical damage, solderability degradation, electrostatic discharge and moisture uptake.

Association Connecting Electronics Industries (IPC)

Updates to IPC-6012 and IPC-A-600 Released: Five Years of New Board Technologies and Processes Bring Significant Changes to Specifications.

Industry News | 2010-04-10 02:09:54.0

If a picture is worth a thousand words, the new H revision of IPC-A-600, Acceptability of Printed Boards, is a priceless work of art for fabricators and assemblers, particularly inspectors and product developers. IPC — Association Connecting Electronics Industries® announces the new releases of IPC-A-600H and its companion document the C revision of IPC-6012, Qualification and Performance Specification for Rigid Printed Boards.

Association Connecting Electronics Industries (IPC)

IPC RELEASES NEW REVISION OF SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD

Industry News | 2010-07-22 22:37:02.0

IPC — Association Connecting Electronics Industries® has released the B revision of IPC-7351, Generic Requirements for Surface Mount Design and Land Pattern Standard. The leading industry standard for surface mount land pattern design and layout, IPC-7351B provides designers and printed board fabricators with updated guidance on requirements of land pattern geometries used for the surface attachment of electronic components, as well as surface mount design recommendations for achieving the best possible solder joints.

Association Connecting Electronics Industries (IPC)

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