Industry News: 30% humidity (Page 3 of 8)

PB Technik to Represent Storagesolutions in Poland

Industry News | 2013-08-30 16:32:16.0

Storagesolutions announces the appointment of PB Technik. As Storagesolutions' newest distributor, PB Technik will represent its complete line of component storage systems throughout Poland.

StorageSolutions

Inovaxe to Exhibit INOCART-MSD at Nepcon East 2008

Industry News | 2008-04-17 16:15:47.0

SARASOTA, FL � April 16, 2008 � Inovaxe Corp., a leader in delivering inventory control solutions to electronics manufacturers, announces that it will showcase INOCART-MSD, a true solution for managing moisture sensitive devices (MSD), in booth 953 at the upcoming Nepcon East exhibition and conference, scheduled to take place April 30-May 1, 2008 at the Boston Convention & Exhibition Center in Boston.

Inovaxe Corporation

Storagesolutions Appoints Distributor for Australasian Market

Industry News | 2014-01-09 18:39:42.0

Storagesolutions announces the appointment of Suba Engineering as its distributor throughout Australia, New Zealand and the Pacific Islands.

StorageSolutions

Seika Machinery, Inc. to Highlight McDry and HIROX Units at SMTA Toronto Expo & Tech Forum

Industry News | 2010-04-30 14:41:57.0

TORRANCE, CA — Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, will feature its McDry Electronic Drying Storage Cases and HIROX 3D Digital Microscopes at the upcoming SMTA Toronto Expo and Tech Forum, scheduled to take place Wednesday, May 19, 2010 at the Hilton Toronto Airport Hotel in Toronto, ON.

Seika Machinery, Inc.

Storagesolutions Brings Its ASC Automatic Storage Systems to The Netherlands for Electronics & Automation 2013

Industry News | 2013-04-24 11:21:02.0

Storagesolutions, today announced that it will exhibit in booth 8D036 at the Electronics & Automation 2013 trade fair, scheduled to take place May 28-30, 2013 at the Royal Dutch Jaarbeurs, Utrecht in The Netherlands.

StorageSolutions

Nihon Superior's Keith Sweatman to Present at APEX 2010

Industry News | 2010-03-30 14:09:38.0

OSAKA, JAPAN - Nihon Superior Co. Ltd., a supplier of advanced soldering and brazing materials to the global market, announces that Keith Sweatman will present a paper titled "Effect of Soldering Method, Temperature, and Humidity on Whisker Growth in the Presence of Flux Residues" at the upcoming IPC/APEX conference and exhibition.

Nihon Superior Co., Ltd.

FCT Assembly’s Development Chemist to Present during SMTAI Poster Sessions

Industry News | 2014-08-28 15:40:58.0

FCT Assembly announces that Development Chemist Brittney Nolan will present during the Poster Sessions at SMTA International. The presentation, entitled “The Impacts of the Environment on the Printability of Solder Paste,” will take place Tuesday, September 30, 2014 from 12-2 p.m. in the Exhibit Hall at the Donald Stephens Convention Center in Rosemont, IL.

FCT ASSEMBLY, INC.

Henkel’s Multicore LF620 Lead-Free Solder Paste Sets the New Benchmark for the Lead-Free Era

Industry News | 2010-04-23 21:21:38.0

Never content to rest on the laurels of its proven lead-free success, Henkel has developed and launched Multicore LF620: a new lead-free solder paste that effectively delivers on a broad range of demanding requirements, essentially offering a lead-free paste that has it all.

Henkel Electronic Materials

Henkel’s Multicore LF730 Raises the Bar on Lead-Free Solder Paste Performance

Industry News | 2009-12-10 01:05:59.0

Building on its successful lead-free solder products portfolio, Henkel has developed Multicore LF730, a Pb-free solder paste born from the company’s unyielding innovation commitment and arguably setting the benchmark for lead-free paste performance.

Henkel Electronic Materials

New Wire Bond Encapsulant and Flexible Circuit Bonding Adhesive Now Available for Printer Head and Circuit Assembly Applications

Industry News | 2012-03-30 18:48:18.0

Engineered Material Systems, a leading global supplier of electronic materials for circuit assembly applications, debuts its 357-348 Wire Bond Encapsulant and Flexible Circuit Bonding Adhesive for printer head and circuit assembly applications.

EMS TECHNOLOGY, INC.


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