Industry News | 2005-02-24 11:44:09.0
TBL Blues are Exclusively Avaialble from Marktech Optoelectronics
Industry News | 2016-09-06 11:22:17.0
Versatile AWG provides all waveforms up to the maximum frequency and offers modulation capabilities too
Industry News | 2019-11-05 22:19:03.0
> News-Blog > Guideline for wire bonding Guideline for wire bonding Tuesday,Jun 12,2018 There are two wire bonding processes that are used, Thermosonic (T/S) Gold Ball Wire Bonding and Ultrasonic (U/S) Aluminum Wedge Wire Bonding. Approximately 90% of all IC Assembly in Semiconductor Packages is manufactured using Gold Ball Bonding process, while Aluminum Wedge Bonding is used to produce about 10% of other Wire Bonding requirements on Printed Circuit Boards (PCB), Printed Circuit Flex (PCF) and other Packages.
| 1 |
