Industry News | 2013-09-30 16:09:37.0
The inaugural IPC APEX India™ conference and exhibition was held 26–29 August at the NIMHANS Convention Centre in Bangalore, India.
Industry News | 2012-02-07 00:45:44.0
IPC and JEDEC have released the C revision of IPC/JEDEC J-STD-033, Handling, Packing, Shipping and Use of Moisture/Reflow and/or Process Sensitive Components. With an expanded scope, the document now covers the handling, packing and shipping of non-IC electronic components that have been classified per EIA/IPC/JEDEC J-STD-075, Classification of Non-IC Electronic Components for Assembly Processes.
Industry News | 2018-10-18 08:00:40.0
SMT solder joint quality and appearance inspection process
Industry News | 2018-10-18 08:01:00.0
SMT solder joint quality and appearance inspection process
Industry News | 2013-01-19 07:46:16.0
Information that inspires innovation is center-stage for design, printed boards, electronics assembly, test and printed electronics
Industry News | 2009-05-29 12:27:20.0
Technology leader Siemens Electronics Assembly Systems (SEAS) unveils the new combined die-bonding and SMD placement application SIPLACE CA. Based on the SIPLACE X-series platform, it is the world's first machine that combines the highest of SMD placement speed with the extreme precision of die-bonding.
Industry News | 2003-03-18 09:28:53.0
Mainly oriented towards small and medium companies and development teams, involved in the PCB assembly, this company specialises in assembling and control of PCBs based on SMD components.
Industry News | 2021-07-13 16:24:19.0
New Vishay Intertechnology SMD HI-TMP Wet Tantalum Capacitors Save Board Space and Feature Operation to +200°C, Increased Thermal Shock Capabilities and Longer Life to 2,000 Hours
Industry News | 2009-01-19 20:34:37.0
Essemtec, the leading manufacturer of surface mount technology production equipment, announces that it will highlight the printer SP150, the pick & place machine Pantera XV and the full convection oven RO300FC-C with RO-CONTROL software in hall no. 18, stand no. 338 at the upcoming COMPONEX NEPCON 2009 exhibition, scheduled to take place February 24-26, 2009, in Delhi, India.
Industry News | 2009-07-17 19:02:35.0
The FLX2011-MK, Essemtec’s production center for flexible circuits and membrane keyboards, is now equipped with a jet valve dispensing system, allowing it to place smaller SMD components and LEDs on flexible circuits. The jet valve dispenses small glue dots more accurately and faster than others, and is contactless.
