Industry News | 2013-09-30 16:09:37.0
The inaugural IPC APEX India™ conference and exhibition was held 26–29 August at the NIMHANS Convention Centre in Bangalore, India.
Industry News | 2012-02-07 00:45:44.0
IPC and JEDEC have released the C revision of IPC/JEDEC J-STD-033, Handling, Packing, Shipping and Use of Moisture/Reflow and/or Process Sensitive Components. With an expanded scope, the document now covers the handling, packing and shipping of non-IC electronic components that have been classified per EIA/IPC/JEDEC J-STD-075, Classification of Non-IC Electronic Components for Assembly Processes.
Industry News | 2018-10-18 08:00:40.0
SMT solder joint quality and appearance inspection process
Industry News | 2018-10-18 08:01:00.0
SMT solder joint quality and appearance inspection process
Industry News | 2013-01-19 07:46:16.0
Information that inspires innovation is center-stage for design, printed boards, electronics assembly, test and printed electronics
Industry News | 2009-05-29 12:27:20.0
Technology leader Siemens Electronics Assembly Systems (SEAS) unveils the new combined die-bonding and SMD placement application SIPLACE CA. Based on the SIPLACE X-series platform, it is the world's first machine that combines the highest of SMD placement speed with the extreme precision of die-bonding.
Industry News | 2003-03-18 09:28:53.0
Mainly oriented towards small and medium companies and development teams, involved in the PCB assembly, this company specialises in assembling and control of PCBs based on SMD components.
Industry News | 2004-10-15 10:33:00.0
The new FLX2010 SMD pick+place from ESSEMTEC offers the most flexible
Industry News | 2009-07-17 19:02:35.0
The FLX2011-MK, Essemtec’s production center for flexible circuits and membrane keyboards, is now equipped with a jet valve dispensing system, allowing it to place smaller SMD components and LEDs on flexible circuits. The jet valve dispenses small glue dots more accurately and faster than others, and is contactless.
Industry News | 2008-03-19 14:49:56.0
Essemtec, a leading manufacturer of surface mount technology production equipment, announces that it will showcase RO300FC-C full convection reflow oven with RO-CONTROL software in booth 501 at the upcoming APEX 2008 exhibition and conference, scheduled to take place April 1-3, 2008, in Las Vegas.
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