Industry News: 3800 controller (Page 1 of 1)

Connected Factory Initiative Subcommittee Makes Significant Progress on Machine Data Interface Standard

Industry News | 2016-12-18 13:51:15.0

Representatives of industry’s leading manufacturers, machine, device, sensor and software companies that comprise IPC’s 2-17 Connected Factory Initiative Subcommittee have made significant strides in developing a machine data interface standard, “Connected Factory Exchange or CFX” that would enable manufacturers, equipment, device and software suppliers to achieve Industry 4.0 benefits.

Association Connecting Electronics Industries (IPC)

Palomar Technologies’ 3800 Ultra Flexible Die Bonder Wins Distinguished Industry Award

Industry News | 2010-10-27 20:21:50.0

Palomar Technologies, a leading supplier of solutions for microelectronic and optoelectronic packaging, announces that it has been awarded a Global Technology Award in the category of Bonding Equipment for its 3800 Ultra Flexible Die Bonder.

Palomar Technologies

Preview for ADLINK Technology for Embedded World 2014 in Nuremberg,

Industry News | 2014-01-20 12:10:43.0

ADLINK Technology Inc., a leading supplier of Application Ready intelligent Platforms and industrial building blocks, will present amongst other products the following new highlights at the Embedded World Show Nuremberg at booth 1/1-538.

ADLINK Technology, Inc.

ADLINK Releases SMARC Module LEC-BT Running Intel® Atom™ Processor E3800 Series System-on-Chip

Industry News | 2014-07-23 13:15:08.0

ADLINK Technology today introduces a new SMARC form factor computer-on-module running on Intel x86 processors. Using a single, dual, or quad core Intel® Atom™ processor E3800 series system-on-chip from 1.3 to 2.2 GHz with soldered memory up to 4GB DDR3L at 1066/1333 MHz including ECC, the ADLINK LEC-BT product delivers top-of-the-line performance in efficient power use that targets a new generation of mobile applications with industrial-grade stability and reliability.

ADLINK Technology, Inc.

ADLINK Announces New ETX Computer-on-Module as a Drop-in Replacement for Existing ETX Systems.

Industry News | 2014-10-23 15:49:33.0

ADLINK Technology today announced a new ETX Computer-on-Module, which uses the latest Intel® Atom™ Processor E3800 SOC Series (formerly codenamed "Bay Trail") with performance scalable from single core at 1.4GHz (Atom™ E3815) to a quad core at 1.9GHz (Atom™ E3845), matched with a single SODIMM socket for up to 4 GB non-ECC 1333/1066 MHz DDR3L memory.

ADLINK Technology, Inc.

XJTAG Releases Boundary Scan for Teradyne TestStation

Industry News | 2014-10-20 23:43:13.0

XJTAG today announced the release of the XJLink2-CFM and XJLink2-CFMx. The new modules provide Teradyne users with integrated access to XJTAG’s powerful test and programming tools, operating under the control of the TestStation™ test program.

XJTAG

NEOTech Finalizes Partnership with Parrot Drones to Manufacture Short Range Reconnaissance Drones for the U.S. Army

Industry News | 2020-04-23 11:11:05.0

NEOTech announces that is has entered into a new manufacturing partnership with Parrot Drones, a leading European group in the fast-growing industry of drones, known for their high performance and ease of use.

NEO Technology Solutions (NEO Tech)

ADLINK Employs Latest Intel® Atom™ and Intel® Celeron® SoC for High Performance, Low Power Designs From SMARC Modules to Rugged Systems

Industry News | 2014-03-20 10:03:43.0

ADLINK Technology announced an array of new products in various form factors based on the latest Intel® Atom™ and Celeron® processors for intelligent systems, featuring a significant performance per watt improvement over previous generations, high integration of both low speed and high speed IO’s, an advanced graphics engine, and virtualization support - all on a sub-10-watt system-on-chip (SoC) that enables small, light, and reliable embedded designs.

ADLINK Technology, Inc.

ADLINK Announces Two New COM Express® Type 2 Modules with Latest Intel® Processors

Industry News | 2014-10-21 00:13:31.0

ADLINK Technology today announced availability of its newest COM Express® Type 2 modules. The new products come in two series, named Express-HL2 and cExpress-BT2, indicating the 4th generation Intel® Core™ processor and latest Intel® Atom™ system-on-chip. The range in footprint and computing power of these new modules meets the varying needs of industrial applications in a cost-efficient manner.

ADLINK Technology, Inc.

NEOTech partners with Numerica to provide new 3D radar for C-UAS & short-range defense missions

Industry News | 2021-02-23 15:19:10.0

NEOTech is thrilled to congratulate Numerica Corporation on the announcement of their new short range surveillance radar system – Spyglass™ Short Range Surveillance Radar. NEOTech is proud to be in partnership with Numerica, providing manufacturing solutions for the Spyglass system.

NEO Technology Solutions (NEO Tech)

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