Industry News: 390 (Page 1 of 2)

MacDermid Alpha Launches ALPHA CVP-390V High Reliability Solder Paste for Harsh Operating Conditions

Industry News | 2021-04-15 12:17:37.0

MacDermid Alpha Electronics Solutions announces the release of ALPHA CVP-390Vhigh reliability solder paste, designed to maximize flexibility in manufacturing and provide excellent electrochemical reliability in harsh operating conditions.

MacDermid Alpha Electronics Solutions

Cobar Solder Products Inc. at IPC APEX EXPO 2018

Industry News | 2018-01-18 04:01:33.0

Cobar Solder Products Inc. part of the Balver Zinn Group announces that it will exhibit together with Amerway Inc. in Booth #2502 at the IPC APEX EXPO, scheduled to take place February 27 – March 1, 2018 at the San Diego Convention Center, California.

Balver Zinn

MacDermid Alpha Electronics Solutions to Feature High Reliability Solutions at SMTA Ohio Valley Expo& Tech Forum

Industry News | 2021-08-18 14:20:47.0

The Assembly Division of MacDermid Alpha Electronics Solutions, a world leader in the production of electronics soldering and bonding materials, will exhibit at the SMTA Ohio Valley Expo& Tech Forumon Wednesday, August 25th at the Holiday Inn in Strongsville, Ohio.

MacDermid Alpha Electronics Solutions

The Balver Zinn Group to Exhibit a Host of Solder Materials at SMT Nuremberg 2015

Industry News | 2015-04-21 16:57:06.0

The Balver Zinn Group announces that they will be attending SMT/Hybrid/Packaging 2015 scheduled to take place May 5-7 in Nuremberg, Germany. They will highlight the company’s latest solder flux and paste technology in Booth #7-308.

Balver Zinn

The Balver Zinn Group Goes with LLE Soluciones & Repstronics to Guadalajara for the SMTA Mexico Expo & Tech Forum

Industry News | 2017-10-06 09:35:20.0

The Balver Zinn Group a leading global manufacturer of solder materials, announces that they will exhibit together with LLE Soluciones & Repstronics at the SMTA Mexico Expo & tech Forum. The SMTA Mexico Expo is scheduled to take place October 18-19, 2017 at the hotel Riu Plaza in Guadalajara, Mexico.

Balver Zinn

Permabond 820 High Temperature Resistant Instant Adhesive for Component Tacking

Industry News | 2010-02-17 21:16:19.0

SOMERSET, NJ ? Permabond 820 quick-setting, instant adhesive resists temperature ranges up to 200ºC (390ºF). Typical ethyl cyanoacrylates only resist temperatures to 82ºC (180ºF). Permabond 820 is a modified ethyl cyanoacrylate that has a fast fixture time and high-temperature resistance, making it an ideal choice when bonding components in position on dual-sided PCBs prior to wave soldering. Permabond 820 is colorless with a viscosity of 100cPs.

Permabond Engineering Adhesives

The Balver Zinn Group Goes with LLE Soluciones to Guadalajara for the SMTA Mexico Expo & Tech Forum

Industry News | 2016-09-16 09:09:51.0

The Balver Zinn Group a leading manufacturer of solder materials, announces that they will exhibit together with LLE Soluciones at the SMTA Mexico Expo & tech Forum on booth #17. The SMTA Expo is scheduled to take place October 5-6, 2016 at the Riu Hotel in Guadalajara, Mexico. Representatives from LLE and Balver Zinn will display the company’s OT2M solder paste, Brilliant B2012 solder wire, SN100C® alloy along with the latest flux technology.

Balver Zinn

The Balver Zinn Group Goes with LLE Soluciones to Guadalajara for the SMTA Mexico Expo & Tech Forum

Industry News | 2016-09-19 19:58:07.0

The Balver Zinn Group announces that they will exhibit together with LLE Soluciones at the SMTA Mexico Expo & tech Forum on booth #17. The SMTA Expo is scheduled to take place October 5-6, 2016 at the Riu Hotel in Guadalajara, Mexico. Representatives from LLE and Balver Zinn will display the company’s OT2M solder paste, Brilliant B2012 solder wire, SN100C® alloy along with the latest flux technology.

Balver Zinn

ESSEMTEC to Introduce SP150 at IPC Midwest 2008

Industry News | 2008-09-15 22:47:48.0

Essemtec will debut the SP150 printer in booth 907 at the upcoming IPC Midwest exhibition & conference, scheduled to take place September 24-25, 2008 in Schaumburg, IL.

ESSEMTEC AG

The Balver Zinn Group to Highlight a Host of Solder Materials during SMT/HYBRID/PACKAGING 2013

Industry News | 2013-03-18 09:48:32.0

The Balver Zinn Group will exhibit numerous leading-edge products at the upcoming SMT/HYBRID/PACKAGING on booth #9-312, which is scheduled to take place from 16-18 April 2013 at the exhibition center in Nuremberg, Germany.

Balver Zinn

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