Industry News | 2018-03-14 15:03:10.0
IPC — Association Connecting Electronics Industries® invites engineers, researchers, academics, technical experts and industry leaders to submit technical conference abstracts and course proposals for IPC APEX EXPO 2019 to be held at the San Diego Convention Center. Professional development courses will take place January 27, 28 and 31, 2019 and the technical conference will take place January 29–31, 2019.
Industry News | 2018-08-06 20:44:43.0
IPC — Association Connecting Electronics Industries® invites researchers, technical experts and industry leaders to submit abstracts for poster presentations at IPC APEX EXPO®, the industry’s premier conference and exhibition for printed board design and manufacturing, electronics assembly and test. Poster presentations are scheduled for Wednesday, January 30, 2019, and will be displayed throughout the event, offering additional visibility.
Industry News | 2018-06-20 20:36:50.0
IPC — Association Connecting Electronics Industries® has extended the deadline of their invitation for engineers, researchers, academics, technical experts and industry leaders to submit abstracts for IPC APEX EXPO 2019 to be held at the San Diego Convention Center. The technical conference will take place January 29–31, 2019. The extended deadline for technical conference abstracts is June 29, 2018.
Industry News | 2019-02-18 17:18:54.0
IPC — Association Connecting Electronics Industries® invites engineers, researchers, academics, technical experts and industry leaders to submit abstracts for IPC APEX EXPO 2020 to be held at the San Diego Convention Center. Professional development courses will take place February 2, 3 and 6, 2020 and the technical conference will take place February 4–6, 2020.
Industry News | 2019-09-10 13:25:11.0
IPC — Association Connecting Electronics Industries® invites researchers, technical experts and industry leaders to submit abstracts for poster presentations at IPC APEX EXPO®, the industry’s premier conference and exhibition for printed board design and manufacturing, electronics assembly and test. Poster presentations are scheduled for Wednesday, February 5, 2020, and will be displayed throughout the event, offering additional visibility.
Industry News | 2019-08-21 22:30:16.0
Test Research, Inc. (TRI) will join the 2019 SMTA International Conference and Exhibition to showcase its integrated Smart Factory Test and Inspection solutions for the PCBA manufacturing industry. Please visit booth #224 to experience TRI's 3D AOI, 3D SPI and AXI solutions in action. We invite you to also help us celebrate our 30th-anniversary as the test and inspection solutions leader for the electronics manufacturing industry.
Industry News | 2019-11-20 10:54:54.0
Test Research, Inc. announces that the company's 3D AOI system, TR7700 SV 3D, received a 2019 Global Technology Award. TRI’s representatives received the award at the productronica International trade fair held on November 12, 2019 at Munich, Germany.
Industry News | 2019-11-20 13:43:25.0
20 November 2019 – Duluth, GA – At a ceremony during Productronica in Munich Germany, Mr. Harald Eppinger, Managing Director at Koh Young Europe proudly accepted the Global Technology Award for the Koh Young KY-P3 M3 pin and terminal automated inspection solution.
Industry News | 2019-05-07 18:13:08.0
Test Research announces that the company’s next generation 3D AOI, TR7700 SV 3D, received the 2019 EM Asia Innovation Award of Outstanding Product of the Year. The award ceremony was held during the 2019 NEPCON China Exhibition in Shanghai, China.
Industry News | 2019-01-06 21:27:59.0
[December 14, 2018 – San Jose, CA] Test Research, Inc. (TRI), the leading test and inspection solutions provider for the electronics manufacturing industry will join IPC APEX EXPO 2019 held at San Diego Convention Center to showcase its Smart Factory inspection and test solutions for the printed circuit board electronics manufacturing industry. Visit TRI at booth #2533 on January 29 – January 31, 2019 to discover the newest innovations in 3D SPI, 3D AOI, 3D CT AXI and multicore ICT.
