Industry News: 3d ic package (Page 1 of 108)

Package Provides Integrated Hall-effect Solution

Industry News | 2003-05-30 08:09:11.0

A new compact package integrates a Hall-effect sensor IC with a back-biasing magnet to achieve high airgap performance and meet restrictive space requirement.

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Legacy Electronics Receives U.S. Patent for 3-D Memory Module with Canopy-type Carriers

Industry News | 2003-05-30 08:26:20.0

The inventors of this module type and holders of the patent are chief technical officer Kenneth J. Kledzik and president Jason C. Engle, both of San Clemente, California.

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International Rectifier Introduces Bi-Directional Dual MOSFET in the FlipFET Package

Industry News | 2003-01-29 13:23:31.0

A Common Drain Configuration that is 80% Smaller than Devices in the TSSOP-8 Package

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Hybrid 3dB Mini SMT Couplers

Industry News | 2003-06-17 08:07:40.0

The Radiall SMT coupler range now includes the new 14.2 x 5.1mm mini type.

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Universal Appeal for Educational Package

Industry News | 2003-03-25 09:24:51.0

The Cadstar Universal package enables educational establishments to provide multiple licences of current generation PCB design solutions for students at a cost equivalent to a standard single licence.

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Integrated Circuit Systems, Inc. Offers Rambus Yellowstone Memory Interface Clock Generators

Industry News | 2003-06-20 08:31:58.0

Leading chip timing solutions provider manufactures fast memory interface clock generators for high-bandwidth applications

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DuPont Electronic Technologies' Printed Circuit Materials Division Announces Price Increase for Riston� Photopolymer Dry Film Resists

Industry News | 2003-06-04 08:27:58.0

DuPont cites rising raw material, transportation and energy costs as reasons for the increase.

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Camden Electronics Appoints New Distributor in Germany for Enclosure Products

Industry News | 2003-06-09 09:41:14.0

Mehlo Bauelemente GmbH specialises in electronic packaging and has 20 years experience serving the German market with a wide range of enclosure products.

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California Micro Devices Announces Enhanced EMI Filtering with ESD Protection for GSM Handsets

Industry News | 2003-02-25 09:10:01.0

The CSPEMI400 complements California Micro Devices' broad portfolio of CSP (chip scale package) devices for stand-alone ESD protection and EMI filter arrays with ESD protection, making it the most extensive in the industry.

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