Industry News | 2019-04-23 08:08:27.0
Saki Corporation announces the release of its new 2Di-LU1 inline bottom-side automated optical inspection (AOI) system at NEPCON China, Shanghai, China, and SMTconnect, Nuremberg, Germany. Saki's 2D line-scan technology is ultra-fast, capturing the image of an entire 460x500mm printed circuit board assembly (PCBA) and carriers of 610x610mm in one pass, in real time, storing the image into memory, and creating inspection data for the entire board.
Industry News | 2010-04-14 21:28:49.0
Saint-Egrève, France - Vi TECHNOLOGY exhibits its full product range of AOI solutions to reduce defective PCBAs at Nepcon China 2010 at Shanghai, from April 20th to 22nd booth 4F10.
Industry News | 2006-11-01 11:22:36.0
- Assembly manufacturing processing time reduced by 50%
Industry News | 2020-03-14 10:19:41.0
YESTECH announced today the introduction of their all new LX-1000 large area Automated Optical Inspection system.
Industry News | 2012-04-16 12:25:38.0
Blakell Europlacer Ltd., a designer and manufacturer of comprehensive SMT equipment for the global electronics industry, announces that its UK distribution division has reported record figures for the first quarter
Industry News | 2014-01-30 10:06:15.0
JUKI announces the launch of the RV-1 PWB inspection machine, which significantly improves inspection accuracy and speed with both automatic optical inspection (AOI) and solder paste inspection (SPI) functions.
Industry News | 2020-06-24 15:22:46.0
The Assembly Solutions division of MacDermid Alpha Electronics Solutions will be introducing its ultra-low temperature solder and 5G solutions at the Productronica China show from July 3-5, 2020, at the National Exhibition and Convention Center in Shanghai.
Industry News | 2015-03-23 12:27:07.0
Mentor Graphics Corporation (NASDAQ: MENT) today announced its new Xpedition® Package Integrator flow, the industry’s broadest solution for integrated circuit (IC), package, and printed circuit board (PCB) co-design and optimization. The Package Integrator solution automates planning, assembly and optimization of today’s complex multi-die packages. It incorporates a unique virtual die model concept for true IC-to-package co-optimization. In support of early marketing-level studies for a proposed new device, users can now plan, assemble and optimize complex systems with minimal source data. The new Package Integrator flow allows design teams to realize faster and more efficient physical path finding and seamless tool integration for rapid prototyping, right to the production flow.
Industry News | 2003-01-30 09:05:09.0
For His Outstanding Contributions to the Application of Finite-element Modeling to Microwave Guides, Structures, and Circuits
Industry News | 2016-02-17 17:51:40.0
Fancort Industries, Inc., now in its 44th year, will exhibit in Booth #3010 at the 2016 IPC APEX EXPO, scheduled to take place March 15-17, 2016 at the Las Vegas Convention Center. The company will showcase its wide selection of equipment and services designed to meet all requirements from prototype to moderate production, specializing in processing high-reliability aerospace grade devices to exacting SMT tolerances. Fancort will display its new line of SMT products, including the new FD Series Desktop Robotic Dispensing, inline and floor mounted depanelers and laser marking from Getech, the JAPAN UNIX SOLDER MEISTER® Desktop Soldering Robot DF Series and its new Magnetic Universal Fixture.
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