Industry News | 2003-02-25 08:18:29.0
Teradyne can now provide deep micro-via technology for customers of high-performance printed circuits.
Industry News | 2003-04-09 08:25:50.0
A new design guide is available from Genalog detailing Samtec's flex circuit capabilities.
Industry News | 2011-01-28 17:29:19.0
Count On Tools Inc. introduces new Ceramic Nozzle Series for the complete line of Universal Instruments Corporation’s (UIC) pick-and-place machines, including Genesis, Advantis, Flexjet and GSM.
Industry News | 2012-04-30 14:15:09.0
Everett Charles Technologies (ECT) introduces the new A7Cf Flying Probe Test System from atg-LM. The double-sided test system features four probes on top and four additional probes on the bottom
Industry News | 2003-02-21 08:45:28.0
The Costa Mesa facility has achieved the highest level of qualification for line width (2 mils) and spacing (3 mils) to date.
Industry News | 2009-07-10 13:30:57.0
Free LED Board Keychain from Saturn Electronics Corporation
Industry News | 2012-09-04 08:51:32.0
Hesse & Knipps, Inc., (www.hesse-knipps.com) has added the HBK08 Loop Former Bondhead to its BONDJET BJ935 and BONDJET BJ939 fully automatic heavy wire bonders to support growing requirements for high density module bonding.
Industry News | 2017-06-22 12:59:47.0
This 2000L 2LE model is capable of imaging a maximum size 24” x 24” PC board or film size. With any large format film, positional accuracy can be a challenge but the Miva’s dynamic scaling feature can increase accuracy to minimize tolerance build-ups during the imaging process. Due to Miva’s optical registration system, innerlayer drill break-out will be reduced considerably on densely routed signal layers which will significantly improve yields. For sub-20-mil pitch parts or micro BGAs, a 2−3 mil solder dam will be possible to eliminate bridging during the assembly process.
Industry News | 2002-07-25 15:47:31.0
Glenbrook Technologies has announced the availability of a newly developed X-ray inspection system, MICROTECH RTX113. The MICROTECH model is designed for ultra-high resolution X-ray inspection requirements such as laser drilling of multi-layer PCBs and populated PCBs containing BGAs, uBGAs and Chip Scale Packages (CSPs).
