Industry News | 2013-10-04 16:50:46.0
Engineered Material Systems Inc will showcase its DF-2000 Series Dry Film Negative Photoresists in booth #14 at the International Wafer Level Packaging Conference (IWLPC), scheduled to take place November 6-7, 2013 at the Doubletree Hotel in San Jose, Calif.
Industry News | 2013-11-09 07:23:20.0
Essemtec AG presents its new SMT production centre for the first time at productronica in Munich.
Industry News | 2014-01-08 17:50:45.0
STI Electronics, Inc.has partnered with ITM to offer a series of courses.
Industry News | 2014-08-28 11:58:53.0
CyberOptics Corporation (Nasdaq: CYBE) announces that Brendan Hinnenkamp, Director of Engineering, will present the paper titled “Inspection Strategies for More Accurate, Faster and Smarter Inspection” at the upcoming SMTA International exhibition.
Industry News | 2014-09-19 20:19:38.0
KYZEN is pleased to announce that Dr. Mike Bixenman will present the paper titled “QFN Design Considerations to Improve Cleaning – A Follow on Study” at the upcoming SMTA International exhibition.
Industry News | 2017-03-20 17:31:31.0
Engineered Material Systems is pleased to introduce the DF-35120 dry-film negative photoresist for use in micro-electro mechanical systems (MEMS), wafer level packaging and CMOS applications (TSV sealing). The dry film is 120 µm thick. This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.
Industry News | 2017-09-21 15:21:57.0
Logic PD will be an Emerging Tech Partner at the American Medical Device Summit in Chicago, Ill., a premier showcase for medical device designers and manufacturers. The company will greet attendees and exhibit some of its recent medical device development successes at booth #29 at the Summit.
Industry News | 2017-10-22 17:38:10.0
Engineered Material Systems is pleased to introduce the DF-2005 dry-film negative photo resist for use in micro-electro mechanical systems (MEMS), wafer-level packaging and CMOS applications (metallization). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.
Industry News | 2011-04-22 21:43:04.0
Data I/O Corporation will showcase the FlashPak III and ProLINE-RoadRunner™ in Booth #772-773 at the upcoming Del Mar Electronics Show, scheduled to take place May 4-5, 2011 at the Del Mar Fairgrounds in Del Mar, CA.
Industry News | 2021-03-09 16:28:04.0
Upgraded VRPower® Smart Power Stages Increase Efficiency and Accuracy to Support the Latest Generation of Microprocessors
