Industry News | 2017-09-06 13:36:35.0
SMTA is proud to announce the Women's Leadership Program at SMTA International. The program takes place from 1:30pm-5:00pm on Monday, September 18, 2017 during the SMTA International Conference and Exhibition in Rosemont, Illinois.
Industry News | 2003-06-13 12:19:32.0
SMTA International Special Symposiums and Emerging Technologies Summit
Industry News | 2019-09-21 04:28:31.0
BTU International, Inc is pleased to announce that Fred Dimock, Manager of Process Technology, will present during SMTA International. Dimock will present “Operation of a Vacuum Reflow Oven with Preliminary Void Reduction Data” during the Jump Start - 101 Technical Session, scheduled to take place Tuesday, Sept. 24, 2019 from 10:30 a.m. - 4:15 p.m. in the Show Floor Theater.
Industry News | 2017-08-26 20:12:45.0
Seika Machinery announces that Michelle Ogihara, Senior Sales Manager at Seika, will co-host the Surface Mount Technology Association (SMTA) Women’s Leadership Program at SMTA International. The event is scheduled to take place Monday, September 18, 2017 from 1:30-6 p.m. and is free to all attendees.
Industry News | 2013-09-11 10:43:09.0
LAPIS Semiconductor, a ROHM Group Company, has recently developed 8-bit microcontrollers equipped with an oscillator circuit that provides more than twice the accuracy compared with previous models.
Industry News | 2016-04-21 00:17:09.0
SHENMAO Technology will present the technical paper "A New Dispensing Solder Paste for Laser Soldering Technology" at the 10th. Anniversary of the SMTA International Conference of Soldering and Reliability 2016 in Toronto, Canada, featuring advancements in newly developed composition of Powder, Fluxes and produces best dispensability, minimal flux residue, no-splash or solder balling issues and minimal and smaller voids.
Industry News | 2016-04-26 10:26:58.0
SHENMAO Technology, Inc. will present the technical paper “A New Dispensing Solder Paste for Laser Soldering Technology” at the 10 th. Anniversary of the SMTA International Conference of Soldering and Reliability 2016 in Toronto, Canada, featuring advancements in newly developed composition of Powder, Fluxes and produces best dispensability, minimal flux residue, no-splash or solder balling issues and minimal and smaller voids.
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