Industry News | 2016-01-12 01:45:47.0
Yamaha Motor IM announced today that Alpha ('Alpha Metals') has chosen the YAMAHA YCP10 High-Performance Compact Printer for purchase and installation at a key laboratory facility in New Jersey. After rigorous print testing, the YCP10 demonstrated the ability to deliver the consistent printing results that the Alpha evaluators were seeking.
Industry News | 2016-08-28 13:20:16.0
BTU International announces that Fred Dimock, Manager of Process Technology, will conduct a reflow workshop during SMTA International at the Donald Stephens Convention Center in Rosemont, IL. The workshop, entitled “Solder Reflow Fundamentals – Understanding and Obtaining Profiles,” is scheduled to take place Sunday, September 25 at 8:30 a.m. CDT in room 52.
Industry News | 2020-04-30 12:10:28.0
BTU International, Inc. is pleased to announce that Fred Dimock, manager of process technology, will host a webinar with the SMTA on Tuesday, May 26, 2020 from 10-11 a.m. CST.
Industry News | 2005-12-15 16:01:05.0
PolarPAK Power MOSFETs With Double-Sided Cooling Offer On-Resistance Down to 1.9 Milliohms Maximum
Industry News | 2010-03-26 23:28:15.0
Everett Charles Technologies announces that Gary St. Onge, Director of US and China Operations, will present a paper titled "Zoom Fixtures for ATE" at the upcoming IPC/APEX conference and exhibition.
Industry News | 2005-11-29 11:31:48.0
New Siliconix Power MOSFETs in Thermally Enhanced PowerPAK 1212-8 Package Combine 3.3 mm by 3.3 mm Footprint, Thermal Resistance of Less Than 2 Degrees Celsius Per Watt, and On-Resistance Values Down to 3.7 Milliohms
Industry News | 2018-08-31 12:50:11.0
Versatile programmable AC+DC power sources suit a variety of test situations and power simulations
Industry News | 2021-11-30 20:11:40.0
ASHCROFT pressure transmitter is one of the most commonly used transmitters in industrial applications. It is widely used in a variety of control environments, involving water conservancy and hydropower, railway transportation, intelligent building, production automation, aerospace, military, petrochemical, oil wells, electric power, ships, machine tools and pipelines.
Industry News | 2018-10-18 08:27:03.0
An Analysis of SMT Solder Paste Printing Defects
Industry News | 2019-11-05 22:19:03.0
> News-Blog > Guideline for wire bonding Guideline for wire bonding Tuesday,Jun 12,2018 There are two wire bonding processes that are used, Thermosonic (T/S) Gold Ball Wire Bonding and Ultrasonic (U/S) Aluminum Wedge Wire Bonding. Approximately 90% of all IC Assembly in Semiconductor Packages is manufactured using Gold Ball Bonding process, while Aluminum Wedge Bonding is used to produce about 10% of other Wire Bonding requirements on Printed Circuit Boards (PCB), Printed Circuit Flex (PCF) and other Packages.
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