Industry News | 2015-02-04 17:11:51.0
On Monday, President Obama released his Fiscal Year 2016 Budget of the U.S. Government. Included in the budget is funding to expand the National Network of Manufacturing Innovation (NNMI) as well as a 5.5 percent increase from 2015 of $146 billion for research and development (R&D) initiatives. “IPC applauds the President for his commitment to grow advanced manufacturing and increase federal R&D investment, both of which are a critical part of IPC’s Global Policy Framework for 2015,” said John Mitchell, IPC President and CEO.
Industry News | 2011-01-18 14:37:31.0
Sponsored jointly by the SMTA and Chip Scale Review magazine, the annual IWLPC explores cutting edge topics in wafer-level packaging and IC/MEMS/MOEMS packaging, including 3D/Stacked/CSP/SiP/SoP and mixed technology packages.
Industry News | 2018-08-16 20:05:44.0
Indium Corporation Research Chemist, Mary Ma, and Area Technical Manager for Eastern China, Wisdom Qu, will present their papers at the 2018 SMTA China South Technology Conference on Aug. 28 in Shenzhen, China. Their papers were voted by their peers as two of the top five “Best Papers” presented in recent years at SMTA South China and SMTA East China, earning them the opportunity to present them again at this year's show.
Industry News | 2014-04-30 16:52:50.0
IPC announced the March findings from its monthly North American Printed Circuit Board (PCB) Statistical Program. Sales were up in March and the book-to-bill ratio strengthened, returning to positive territory.
Industry News | 2013-01-31 17:40:20.0
IPC announced today the December findings from its monthly North American Printed Circuit Board (PCB) Statistical Program.
Industry News | 2010-05-30 16:23:14.0
BANNOCKBURN, Ill., USA — IPC — Association Connecting Electronics Industries® announced today the April findings from its monthly North American Printed Circuit Board (PCB) Statistical Program.
Industry News | 2011-01-05 15:13:37.0
IPC announced the November findings from its monthly North American Printed Circuit Board (PCB) Statistical Program.
Industry News | 2011-06-29 16:51:09.0
IPC announced today the May findings from its monthly North American Printed Circuit Board (PCB) Statistical Program.
Industry News | 2021-04-22 17:10:07.0
New ESD-Protection Diode with Wettable Flanks Features Low Capacitance to 0.37pF typical in the Compact DFN1110-3A Package
Industry News | 2015-10-11 16:48:23.0
Specialty Coating Systems (SCS) is pleased to announce that Dr. Rakesh Kumar, VP of Technology, will present at the International Wafer-Level Packaging Conference on Wednesday, Oct. 14, 2015 at the Double Tree San Jose Airport Hotel in San Jose, CA. Dr. Kumar will present "A High Temperature Vapor Phase Polymer for Wafer-Level Packaging" from 5-5:30p.m. in the San Carlos Room.
