Industry News: 5 zone (Page 3 of 11)

MANNCORP ADDS TWO HIGHER-THROUGHPUT PCB ASSEMBLY SYSTEMS TO TURNKEY LINE-UP

Industry News | 2010-05-26 15:11:08.0

In response to increased interest from OEMs aiming to cut costs by bringing PCB assembly in-house, Manncorp has expanded the top end of its turnkey lines. The two new systems are the “High-Throughput Flex Line” which includes twin MC-385 pick and place machines with a combined placement rate of 10,000 cph, and the “Box Builder Line” with the MC-387 placer that houses a huge 224-feeder capacity.

Manncorp

ESSEMTEC to Highlight Key Products and Technologies at APEX 2009

Industry News | 2009-03-27 09:58:30.0

Essemtec announces that it will feature its innovative products in booth 243 at the upcoming APEX 2009 exhibition and conference, scheduled to take place March 31-April 2, 2009, in Las Vegas. These machines will be offered at Special Show Pricing, so be sure to stop by the booth.

ESSEMTEC AG

Bentek Solar to Exhibit Utility-Scale Fused Disconnect Safety System (FDSS) at Solar Power International

Industry News | 2012-08-23 16:29:40.0

–Bentek Solar, will exhibit the 1000VDC Fused Disconnect Safety System (FDSS) with visible blade disconnects in Booth #4081

Bentek Solar

Bentek Solar Completes Phase 1 FDSS Shipments for 130MW Utility-Scale Project in Ontario, Canada

Industry News | 2012-10-24 07:52:37.0

Bentek Solar announces that it has successfully designed and shipped Phase 1, which includes 70MW of 1000VDC Fused Disconnect Safety Systems (FDSS) with visible blade disconnects into Ontario, Canada that complies with the Canadian Feed-In-Tariff (FIT) program

Bentek Solar

Juki Releases New RS-600 Six Zone Reflow Oven

Industry News | 2014-04-30 16:32:59.0

Juki Automation Systems (JAS), Inc. today announced the release of its new RS-600 Six Zone Air and Nitrogen Reflow Ovens. 

Juki Automation Systems

BTU International's PYRAMAX� 150z12 Thermal Processing System Wins a 2009 Innovation Award

Industry News | 2009-04-23 20:21:13.0

NORTH BILLERICA, Mass., April 23, 2009 � BTU International (Nasdaq: BTUI), a leading supplier of advanced thermal processing equipment for the alternative energy and electronics manufacturing markets, has been awarded a 2009 EMAsia Innovation Award in the category of Reflow Soldering Equipment for its PYRAMAX� 150z12 thermal processing system. The award was presented to the company during an April 22, 2009 ceremony that took place at the Shanghai Everbright International Hotel during Nepcon China 2009.

BTU International

BTU International’s PYRAMAX Thermal Processing System Wins 2010 Innovation Award

Industry News | 2010-04-22 20:13:46.0

NORTH BILLERICA, Mass. - BTU International (Nasdaq: BTUI), a leading supplier of advanced thermal processing equipment and processes for the alternative energy and electronics manufacturing markets, has been awarded a 2010 EM Asia Innovation Award in the category of Reflow Soldering Equipment for its PYRAMAX™ 150Nz12 thermal processing system. The award was presented to the company during an April 21, 2010 ceremony held at the Shanghai Everbright Convention & Exhibition Center during NEPCON China 2010.

BTU International

BTU International’s PYRAMAX™ Convection Reflow Oven Wins Triple Crown

Industry News | 2010-10-26 23:17:35.0

BTU International, a leading supplier of advanced thermal processing equipment and processes for the alternative energy and electronics manufacturing markets, has been awarded a 2010 Global Technology Award in the category of Soldering Equipment for its PYRAMAX™ 150Nz12 thermal processing system.

BTU International

Lead-free Reflow Profile: Soaking type vs. Slumping type

Industry News | 2018-10-18 08:44:36.0

Lead-free Reflow Profile: Soaking type vs. Slumping type

Flason Electronic Co.,limited

Essemtec to Exhibit New Reflow Oven at Productronica 2007

Industry News | 2007-11-01 01:30:11.0

Essemtec will introduce RO-VARIO, a reflow oven with a new, flexible concept, in booths A5-277 and A5-278 at the upcoming Productronica 2007 exhibition and conference scheduled to take place November 13-16, 2007 at the New Munich Trade Fair Center in Munich, Germany.

ESSEMTEC AG


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