Industry News | 2015-04-23 08:34:29.0
Engineered Materials Systems will exhibit in Booth #202 at ECTC 2015, scheduled to take place May 26-29, 2015 at the Sheraton Hotel and Marina in San Diego, CA. Company representatives will showcase its DF-3000 Series Negative Film Photoresists.
Industry News | 2015-06-17 14:45:34.0
Engineered Material Systems is pleased to introduce the DF-3005 Dry Film Negative Photo Resist for use in micro-electromechanical systems (MEMS) and wafer level packaging applications (TSV sealing). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.
Industry News | 2015-12-05 16:34:44.0
Engineered Materials Systems will exhibit at the 3D Architectures for Semiconductor Integration and Packaging Conference and Exhibition, scheduled to take place December 15-17, 2015 at the Sofitel San Francisco bay Hotel in Redwood City, CA. Company representatives will showcase the DF-1000 Series Negative Film Photoresists.
Industry News | 2008-05-12 19:23:28.0
Agilent Technologies Inc. (NYSE: A) today introduced the industry's only flying leads probing solution for its PCI Express (PCIe) 2.0 E2960B Series analyzers. The flying leads probe 2.0 allows access to PCIe 2.0 links with no designed-in connectors at both 2.5 Giga Transfer per second (GT/s) and 5.0 GT/s rates. This type of probing access is essential for debugging embedded designs.
Industry News | 2020-05-03 22:17:05.0
Eelink Temperature Monitoring Solution uses an advanced wireless temperature monitoring technical, which uses cutting-edge temperature becon devices to collect temperature data, and transmits the temperature data to the software APP through the server. This device has built-in high-sensitivity temperature sensors, humidity sensor, ble5.0 chipset.
Industry News | 2003-02-28 08:14:43.0
The new LaneLink 4X and 12X connectors are a cable-to-board I/O system optimised for differential signalling at 2.5Gbit/s per pair.
Industry News | 2007-06-07 10:40:11.0
Agilent Technologies Inc. (NYSE: A) today introduced a PCIe-GPIB half-height interface card for compact next-generation PCs that harnesses the fast data transfer rate of PCI Express to support high-bandwidth PC applications.
Industry News | 2007-11-04 19:25:08.0
Aesch/Switzerland � Essemtec AG, a leading manufacturer of surface mount technology production equipment, announces that it will highlight SP900 inline printer in booths A5-277 and A5-278 at the upcoming Productronica 2007 exhibition and conference scheduled to take place November 13-16, 2007 at the New Munich Trade Fair Center in Munich, Germany.
Industry News | 2012-04-26 20:46:21.0
BTU International, Inc., a leading supplier of advanced thermal processing equipment for the alternative energy and electronics manufacturing markets, announces that it has been awarded a 2012 EM Asia Innovation Award in the category of Reflow Soldering Equipment for its PYRAMAX™ 100N convection reflow oven.
Industry News | 2012-09-12 19:49:58.0
BTU International, Inc., will highlight new High Efficiency (HE) flux management and new dual-lane, dual-speed capabilities of its PYRAMAX™ solder reflow system
