Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Industry News | 2014-01-17 12:52:25.0
BEST Inc., has developed a line of Kapton™ SMT stencils for the prototype assembly market. These stencils, available in 4,5 and 6 thicknesses, present very flat coplanar printing surfaces for solder paste printing. . They are designed to be used when the there are very few boards to be made at one time and the pitch of the components is 1.00 and above.
Industry News | 2003-07-08 09:09:15.0
Available for Devices Up to 13 mm2 with Speeds Up to 1 GHz
Industry News | 2010-04-10 23:59:50.0
LOS ALAMITOS, CA - Following the success of their 2007 test board and kit, Practical Components and Aim Solder have updated their offering with a new AIM print test board and kit that is designed to include many printing challenges commonly found in manufacturers' assemblies.
Industry News | 2008-10-07 12:56:56.0
APS Novastar introduces automatic Vision Control for its L-Series pick and place systems. Vision Control advances the already precise, fast and reliable placement of 0201's with 100% accurate on-the-fly, bottom-up vision placement of micro BGA's and ultra fine pitch QFP's.
Industry News | 2004-09-29 21:38:11.0
Frenchtown, NJ, September 2004
Industry News | 2010-03-24 14:37:48.0
Pomona, CA, March 2010 — Everett Charles Technologies (ECT) Fixture Services Group (FSG) announces that it will debut the company’s latest technologies in booth 1283 at the upcoming IPC/APEX conference and exhibition, scheduled to take place April 6-8, 2010 at the Mandalay Bay Resort & Convention Center in Las Vegas.
Everett Charles Technologies (acquired by LTX-Credence, which was acquired by Cohu)
Industry News | 2017-03-23 11:33:40.0
Outline of PNC Inc's BGA assembly capabilities.
Industry News | 2019-11-05 22:19:03.0
> News-Blog > Guideline for wire bonding Guideline for wire bonding Tuesday,Jun 12,2018 There are two wire bonding processes that are used, Thermosonic (T/S) Gold Ball Wire Bonding and Ultrasonic (U/S) Aluminum Wedge Wire Bonding. Approximately 90% of all IC Assembly in Semiconductor Packages is manufactured using Gold Ball Bonding process, while Aluminum Wedge Bonding is used to produce about 10% of other Wire Bonding requirements on Printed Circuit Boards (PCB), Printed Circuit Flex (PCF) and other Packages.
