Industry News | 2013-01-19 07:46:16.0
Information that inspires innovation is center-stage for design, printed boards, electronics assembly, test and printed electronics
Industry News | 2010-03-17 18:31:55.0
EAST HANOVER, NJ – Zymet has introduced a new silica-filled reworkable board-level underfill encapsulant, X2825, whose coefficient of thermal expansion, CTE, is 26 ppm/°C. The underfill enhances drop and shock test reliability and, compared to higher CTE underfills, provides superior thermal cycle performance.
Industry News | 2020-12-10 14:08:30.0
Exxelia Temex' New CF & CFS Series Designed for Military Aircraft Ground Vehicles, Facilities Payloads Radars and Detection Naval Soldier Equipment
Industry News | 2009-11-24 22:07:52.0
Henkel’s in-depth materials development initiatives surrounding halogen-free innovation has yielded another process-enabling product. Multicore HF108 is a lead-free, halogen-free solder paste that combines all of the benefits of robust lead-free materials with the advantage of no deliberately added halogen and is now commercially available.
Industry News | 2022-04-06 10:36:55.0
South-Tek Systems announces the company's 25-year milestone. The company has been designing and manufacturing dependable nitrogen generation technology since 1997. South-Tek's nitrogen generators drive cost savings and efficiency for a vast range of industrial, military, lab and commercial applications.
Industry News | 2003-02-21 18:48:56.0
Machine Vision Products, Inc. (MVP), global leader in automated optical inspection (AOI) and process control solutions, today has announced that it will introduce its new Supra inspection system at APEX 2003, in Anaheim, California, March 31 through April 2.MVP will introduce its new Supra inspection system at APEX 2003.
Industry News | 2009-05-26 18:16:29.0
In a remarkable breakthrough for underfill materials development, Henkel has engineered and launched a new underfill system that delivers on an unprecedented array of complex and demanding requirements, including room temperature fast flow, low temperature cure and reworkability. The new material, Hysol� UF3800�, has been specifically designed for use with today's CSP and BGA devices and is particularly well-suited for handheld communication and entertainment applications.
| 1 |
winsouce.jpg)
