Industry News | 2021-02-12 16:00:16.0
Seika Machinery, Inc. is pleased to announce its participation in the 2021 IPC APEX Virtual EXPO, scheduled to take place March 9-11, 2021 online at www.ipcapexexpo.org. Seika will highlight the Sawa SC-BM500E Automatic Ultrasonic Metal Stencil Cleaner, Sayaka SAM-CT34NJW Twin Table PCB Router with online camera for programming, Tsuchiyama n=1 Checker FAI and Kyowa PCAS Software Series for PCB Measurement.
Industry News | 2020-09-01 12:27:21.0
Seika Machinery, Inc. is pleased to announce its participation in the SMTA International Virtual Conference & Exposition. The Live Virtual Expo is scheduled to take place Sept. 28-30, 2020. Seika will highlight the Sawa SC-BM500E Automatic Ultrasonic Metal Stencil Cleaner, Sayaka SAM-CT34NJW Twin Table PCB Router with online camera for programming, Tsuchiyama n=1 Checker FAI and Kyowa PCAS Software Series for PCB Measurement.
Industry News | 2009-07-17 19:02:35.0
The FLX2011-MK, Essemtec’s production center for flexible circuits and membrane keyboards, is now equipped with a jet valve dispensing system, allowing it to place smaller SMD components and LEDs on flexible circuits. The jet valve dispenses small glue dots more accurately and faster than others, and is contactless.
Industry News | 2010-03-10 16:12:57.0
Medway, MA — March 2010 —Milara Incorporated, a leader in stencil printing technological innovation, announces the integration of the CyberOptics 3-D post-print inspection head on its TouchPrint Digital TD2929 inline printer. The system will be on display at IPC/APEX 2010 in booth #959.
Industry News | 2015-07-28 18:38:42.0
ntroducing the New iCoat Series, Selective Conformal Coating Robot ETS Energy Technology Systems will begin rolling out a new generation of ANDA selective conformal coating machines called the iCoat Series for the North American market this coming October 2015. The iCoat Series is made up of three new coating machine models, known as the iCoat-X3, iCoat-Xt and iCoat-6. The new iCoat Selective Coating platform comes equipped with many new standard features to improve user operation and provide an exceptionally long factory life.
Industry News | 2024-10-13 18:40:00.0
PEMTRON is pleased to announce that it will be exhibiting its innovative D2 (Dual Lane & Dual Head) Series at SMTA Tijuana, scheduled to take place Nov. 7, 2024 at the Quartz Hotel Tijuana. The D2 System is revolutionizing the field of Solder Paste Inspection (SPI) with its industry-leading dual lanes and dual heads feature, allowing for the simultaneous inspection of two different PCBs. This cutting-edge technology dramatically enhances productivity and throughput, making it a vital tool for high-demand manufacturing environments.
Industry News | 2024-09-16 18:52:11.0
PEMTRON is pleased to announce that its D2 (Dual Lane & Dual Head) Series AOI and SPI system has received a Mexico Technology Award in the category of Inspection Equipment – SPI Systems. The award was announced during a ceremony that took place on Wednesday, September 11, 2024 during SMTA Guadalajara in Mexico.
Industry News | 2009-05-06 14:53:51.0
With the SIPLACE SX, Munich-based technology leader Siemens Electronics Assembly Systems (SEAS) introduces a placement machine that opens the door to totally new manufacturing concepts and delivers significantly more efficiency in response to increasingly frequent product changeovers and massive demand fluctuations.
Industry News | 2010-08-17 13:40:20.0
The SIPLACE Team has unveiled its latest placement machine, the SIPLACE SX4. As a high-speed addition to the SIPLACE SX platform, the four-gantry machine sets new standards in terms of placement performance per square meter of floor space – an important metric in the investment decision-making process. With its placement speed of up to 120,000 cph on a footprint of only 1.90 x 2.65 meters, the new machine even surpasses the previous record-holder SIPLACE X4i in terms of performance per square meter.
Industry News | 2024-11-10 19:19:22.0
PEMTRON is proud to announce that its D2 System has received two prestigious honors at Nepcon Asia: the Step-by-Step Excellence Gold Award and the Step-by-Step Innovation Award. These awards, presented on the show floor on Nov. 7, 2024, highlight the groundbreaking impact of the D2 Dual Lane & Dual Head Solder Paste Inspection (SPI) System.
