Industry News: 58bi (Page 1 of 1)

SHENMAO to Exhibit Low-Temperature Solder Pastes at SMTA Ohio Expo

Industry News | 2019-07-09 20:13:00.0

SHENMAO America, Inc. is pleased to announce that it will exhibit at the SMTA Ohio Expo & Tech Forum, scheduled to take place Thursday, August 8, 2019 at the Holiday Inn Cleveland Strongsville in Strongsville. The company will showcase its PF735-PQ10 low temperature solder paste.

Shenmao Technology Inc.

SHENMAO America Introduces Advanced Low-Temperature Ball Attachment Process Solutions for Ultra-Thin Electronics Packages

Industry News | 2024-09-16 18:36:04.0

SHENMAO America, Inc. is proud to introduce its latest innovation in response to the rising demand for ultra-thin electronic packages. As package thinness increases, issues like package warpage and its detrimental effects on production yield have become critical challenges. SHENMAO is addressing these concerns with its new Low-Temperature Solder (LTS) materials, which are engineered to lower reflow temperatures, mitigating PCB and substrate deformation while enhancing overall yield rates.

Shenmao Technology Inc.

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