Industry News | 2015-01-15 19:44:09.0
SMTA and Chip Scale Review magazine announced the best papers from the 2014 International Wafer-Level Packaging Conference (IWLPC.) Winners were selected from each of the three tracks covering Wafer Level Packaging, 3-D (Stacked) Packaging, and MEMS Packaging, as well as an overall Best Paper and Best of Conference winner. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging.
Industry News | 2011-07-13 15:34:21.0
Multitest announces that Reinhart Richter has been promoted to President of the Multitest Group effective immediately.
Industry News | 2011-07-22 23:05:33.0
Everett Charles Technologies - Electrical Test (ET) has appointed Vincent Yu to Technical Marketing Director for Asia.
Industry News | 2003-04-16 08:12:30.0
Revises Restatement of First and Second Quarters and Results of Third Quarters of 2003
Industry News | 2011-03-09 21:57:49.0
The CBA Group, comprised of Universal Instruments Corporation and Hover-Davis, announces the appointment of Debbora (Deb) Ahlgren as Vice President of Marketing, reporting to Jean-Luc Pelissier, CEO and President of CBA, Universal Instruments and Hover-Davis.
Industry News | 2015-02-04 17:36:37.0
CyberOptics® Corporation announces that it will demonstrate the new SQ3000™ 3D Automated Optical Inspection (AOI) system in Booth #3332 at the IPC APEX EXPO, Feb. 24-26, 2015 at the San Diego Convention Center in California.
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