Industry News | 2013-03-07 14:04:01.0
BTU International, Inc.will showcase its new DYNAMO™ solder reflow oven in booth #D60 at the 27th International Electrical, Energy and Automation Industry Fair (FIEE), scheduled to take place April 1-5, 2013, at the Anhembi Exhibition Centre, in Sao Paulo, Brazil.
Industry News | 2016-02-24 15:04:42.0
Coming off a highly successful global launch at Productronica in November, the MPM Edison printing system makes its North American debut at this year's Apex show. As the next generation in printing technology, with patented features throughout its design, the Edison operates at twice the speed and with 25% more accuracy than other printers. With an all new highly-efficient parallel processing stencil shuttle system, wiper, vision gantry, the Edison is capable of reducing your total cycle time by as much as 15 seconds as compared to competitive printers (includes stencil wipe and printing).
Industry News | 2008-01-08 14:27:06.0
A new generation of forced hot air lead-free CR reflow systems that meet the high temperature and tight process control requirements of lead-free while occupying up to 30% less floor space, are now offered by Manncorp.
Industry News | 2008-01-16 13:38:40.0
Farnborough, UK - January 16, 2008 � BTU Europe, a leading supplier of advanced thermal processing equipment for the electronics manufacturing and alternative energy generation markets, announces it will be represented by distributor Esman Elektronik AS in hall 7, booth D120 at the upcoming Electrotech Expo.
Industry News | 2021-02-23 15:00:48.0
BTU International, Inc. today announced plans to exhibit at SEMICON China, scheduled to take place March 17-19, 2021 at the Shanghai New International Expo Centre. The PYRAMAX™ Vacuum Reflow Oven will be displayed in the CohPros booth, Hall E7 #7343.
Industry News | 2017-05-10 18:01:37.0
SEHO Systems GmbH today announced plans to exhibit in Stand 7E048 at Electronics & Applications, scheduled to take place May 30-June 1, 2017 in Utrecht, Netherlands. SEHO’s representative KVMS will demonstrate the PowerWave 4.0 wave soldering system, which is ideally suited for medium to large production series.
Industry News | 2019-03-25 19:51:31.0
KIC today announced plans to exhibit in Booth 1G10 at NEPCON China, scheduled to take place April 24-26, 2019 at the Shanghai World Expo Exhibition & Convention Center. Company representatives will showcase the new SRA (Smart Reflow Analyzer) and RPI i4.0
Industry News | 2019-08-08 08:16:10.0
KIC today announced plans to exhibit in Booth 1C01 at NEPCON Asia, scheduled to take place Aug 28-30, 2019 at the Shenzhen Convention and Exhibition Center. Company representatives will showcase the new SRA (Smart Reflow Analyzer) and RPI i4.0
Industry News | 2013-10-22 14:16:04.0
BTU International announces that it has been awarded seven unit order for its DYNAMO™ from a top Chinese consumer electronics manufacturer.
Industry News | 2014-04-02 15:58:39.0
BTU International, Inc. announces that its representative Innovision Co. will exhibit its DYNAMO™ in Booth T113 at SMT / PCB & NEPCON Korea, scheduled to take place April 2-4, 2014, at the Coex Convention & Exhibition Center in Seoul, South Korea.
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